Bernhard Weidgans

Person

Bernhardswald, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device power metallization layer with stress-relievin...
- Patent number 11,276,624
- Issue date Mar 15, 2022
- Infineon Technologies Austria AG
- Michael Nelhiebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of processing a semiconductor chip
- Patent number 11,164,830
- Issue date Nov 2, 2021
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for power metallization in semiconductor devices
- Patent number 11,127,693
- Issue date Sep 21, 2021
- Infineon Technologies AG
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,069,644
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with compressive interlayer
- Patent number 10,700,019
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Marianne Mataln
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with compressive interlayer
- Patent number 10,658,309
- Issue date May 19, 2020
- Infineon Technologies AG
- Marianne Mataln
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrolyte, method of forming a copper layer and method of forming...
- Patent number 10,648,096
- Issue date May 12, 2020
- Infineon Technologies AG
- Werner Robl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device with metal structure electrically connected to...
- Patent number 10,651,140
- Issue date May 12, 2020
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices for integration with light emitting chips and...
- Patent number 10,607,972
- Issue date Mar 31, 2020
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressive interlayer having a defined crack-stop edge extension
- Patent number 10,304,782
- Issue date May 28, 2019
- Infineon Technologies AG
- Marianne Mataln
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of processing a semiconductor chip
- Patent number 10,134,697
- Issue date Nov 20, 2018
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal structure electrically connected to...
- Patent number 10,090,265
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 10,049,994
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices for integration with light emitting chips and...
- Patent number 9,966,368
- Issue date May 8, 2018
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer metal pads
- Patent number 9,887,170
- Issue date Feb 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device
- Patent number 9,875,978
- Issue date Jan 23, 2018
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices for integration with light emitting chips and...
- Patent number 9,704,839
- Issue date Jul 11, 2017
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer metal pads
- Patent number 9,666,546
- Issue date May 30, 2017
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor workpiece and semiconductor w...
- Patent number 9,627,335
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Stephan Henneck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making a semiconductor chip device
- Patent number 9,502,248
- Issue date Nov 22, 2016
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pads and methods of formation thereof
- Patent number 9,362,216
- Issue date Jun 7, 2016
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor workpiece with metallization
- Patent number 9,293,371
- Issue date Mar 22, 2016
- Infineon Technologies AG
- Anja Reitmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a protective structure on a chip ba...
- Patent number 9,209,080
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor workpiece with metallization
- Patent number 9,093,385
- Issue date Jul 28, 2015
- Infineon Technologies AG
- Anja Gissibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pads and methods of formation thereof
- Patent number 9,082,626
- Issue date Jul 14, 2015
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 8,822,327
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a metal pad structure of a die, a method f...
- Patent number 8,765,531
- Issue date Jul 1, 2014
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
- Publication number 20240120298
- Publication date Apr 11, 2024
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ASSEMBLY
- Publication number 20230178696
- Publication date Jun 8, 2023
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Power Metallization Layer with Stress-Relievin...
- Publication number 20210183732
- Publication date Jun 17, 2021
- Michael Nelhiebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier for Power Metallization in Semiconductor Devices
- Publication number 20200111754
- Publication date Apr 9, 2020
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20200105704
- Publication date Apr 2, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device with Compressive Interlayer
- Publication number 20190273050
- Publication date Sep 5, 2019
- Marianne Mataln
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compressive Interlayer Having a Defined Crack-Stop Edge Extension
- Publication number 20190067209
- Publication date Feb 28, 2019
- INFINEON TECHNOLOGIES AG
- Marianne Mataln
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and method of processing a semiconductor chip
- Publication number 20190043818
- Publication date Feb 7, 2019
- INFINEON TECHNOLOGIES AG
- Dietrich BONART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...
- Publication number 20180366427
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Metal Structure Electrically Connected to...
- Publication number 20180350761
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices for Integration with Light Emitting Chips and...
- Publication number 20180308830
- Publication date Oct 25, 2018
- INFINEON TECHNOLOGIES AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Metal Pads
- Publication number 20170317042
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices for Integration with Light Emitting Chips and...
- Publication number 20170271313
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES FOR INTEGRATION WITH LIGHT EMITTING CHIPS AND...
- Publication number 20170141090
- Publication date May 18, 2017
- INFINEON TECHNOLOGIES AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE
- Publication number 20170110423
- Publication date Apr 20, 2017
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Metal Structure Electrically Connected to...
- Publication number 20160379947
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and method of processing a semiconductor chip
- Publication number 20160204075
- Publication date Jul 14, 2016
- INFINEON TECHNOLOGIES AG
- Dietrich BONART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTE, METHOD OF FORMING A COPPER LAYER AND METHOD OF FORMING...
- Publication number 20160168739
- Publication date Jun 16, 2016
- INFINEON TECHNOLOGIES AG
- Werner ROBL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Processing a Semiconductor Workpiece and Semiconductor W...
- Publication number 20150325535
- Publication date Nov 12, 2015
- INFINEON TECHNOLOGIES AG
- Stephan HENNECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20150294911
- Publication date Oct 15, 2015
- INFINEON TECHNOLOGIES AG
- Anja Reitmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Pads and Methods of Formation Thereof
- Publication number 20150287668
- Publication date Oct 8, 2015
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Deposition with Reduced Stress
- Publication number 20150235855
- Publication date Aug 20, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Conductive Pads and Methods of Formation Thereof
- Publication number 20150028461
- Publication date Jan 29, 2015
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20140357055
- Publication date Dec 4, 2014
- INFINEON TECHNOLOGIES AG
- Anja Gissibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140319689
- Publication date Oct 30, 2014
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Producing the Same
- Publication number 20140167224
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Deposition with Reduced Stress
- Publication number 20140117509
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140048941
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS

Bernhard Weidgans

Person

Patents Grantslast 30 patents

Semiconductor device including a solder compound containing a compo...

Method of forming an aluminum oxide layer, metal surface with alumi...

Semiconductor device power metallization layer with stress-relievin...

Semiconductor chip and method of processing a semiconductor chip

Barrier for power metallization in semiconductor devices

Semiconductor device including a solder compound containing a compo...

Semiconductor device with compressive interlayer

Semiconductor device with compressive interlayer

Electrolyte, method of forming a copper layer and method of forming...

Semiconductor device with metal structure electrically connected to...

Semiconductor devices for integration with light emitting chips and...

Compressive interlayer having a defined crack-stop edge extension

Semiconductor chip and method of processing a semiconductor chip

Semiconductor device with metal structure electrically connected to...

Contact pads with sidewall spacers and method of making contact pad...

Semiconductor devices for integration with light emitting chips and...

Multi-layer metal pads

Semiconductor chip device

Semiconductor devices for integration with light emitting chips and...

Multi-layer metal pads

Method for processing a semiconductor workpiece and semiconductor w...

Methods for making a semiconductor chip device

Conductive pads and methods of formation thereof

Method for processing a semiconductor workpiece with metallization

Semiconductor device comprising a protective structure on a chip ba...

Method for processing a semiconductor workpiece with metallization

Conductive pads and methods of formation thereof

Contact pads with sidewall spacers and method of making contact pad...

Method for manufacturing a metal pad structure of a die, a method f...

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...

OPTOELECTRONIC ASSEMBLY

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

Semiconductor Device Power Metallization Layer with Stress-Relievin...

Barrier for Power Metallization in Semiconductor Devices

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

Semiconductor Device with Compressive Interlayer

Compressive Interlayer Having a Defined Crack-Stop Edge Extension

Semiconductor chip and method of processing a semiconductor chip

Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...

Semiconductor Device with Metal Structure Electrically Connected to...

Semiconductor Devices for Integration with Light Emitting Chips and...

Multi-Layer Metal Pads

Semiconductor Devices for Integration with Light Emitting Chips and...

SEMICONDUCTOR DEVICES FOR INTEGRATION WITH LIGHT EMITTING CHIPS AND...

SEMICONDUCTOR CHIP DEVICE

Semiconductor Device with Metal Structure Electrically Connected to...

Semiconductor chip and method of processing a semiconductor chip

ELECTROLYTE, METHOD OF FORMING A COPPER LAYER AND METHOD OF FORMING...

Method for Processing a Semiconductor Workpiece and Semiconductor W...

METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE

Conductive Pads and Methods of Formation Thereof

Metal Deposition with Reduced Stress

Conductive Pads and Methods of Formation Thereof

METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

Semiconductor Device and Method of Producing the Same

Metal Deposition with Reduced Stress

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...