Bert Reents

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Galvanic process for filling through-holes with metals, in particul...
- Patent number 9,526,183
- Issue date Dec 20, 2016
- Atotech Deutschland GmbH
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Galvanic process for filling through-holes with metals, in particul...
- Patent number 9,445,510
- Issue date Sep 13, 2016
- Atotech Deutschland GmbH
- Bert Reents
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic method for filling holes and cavities with metals
- Patent number 8,784,634
- Issue date Jul 22, 2014
- Atotech Deutschland GmbH
- Bert Reents
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for electrolytically treating an at least superfi...
- Patent number 7,767,065
- Issue date Aug 3, 2010
- Atotech Deutschland GmbH
- Reinhard Schneider
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCU...
- Publication number 20220304164
- Publication date Sep 22, 2022
- Atotech Deutschland GmbH & Co. KG
- Akif ÖZKÖK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20220279662
- Publication date Sep 1, 2022
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GALVANIC PROCESS FOR FILLING THROUGH-HOLES WITH METALS, IN PARTICUL...
- Publication number 20160270241
- Publication date Sep 15, 2016
- Atotech Deutschland GmbH
- Bert REENTS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrolytic Method For Filling Holes and Cavities With Metals
- Publication number 20090301889
- Publication date Dec 10, 2009
- Atotech Deutschland GmbH
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Galvanic process for filling through-holes with metals, in particul...
- Publication number 20090236230
- Publication date Sep 24, 2009
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of electroplating a workpiece having high-aspect ratio holes
- Publication number 20060151328
- Publication date Jul 13, 2006
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Device and method for electrolytically treating an at least superfi...
- Publication number 20060076241
- Publication date Apr 13, 2006
- Reinhard Schneider
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Bert Reents

Person

Patents Grantslast 30 patents

Method of preparing a high density interconnect printed circuit boa...

Manufacturing sequences for high density interconnect printed circu...

Galvanic process for filling through-holes with metals, in particul...

Galvanic process for filling through-holes with metals, in particul...

Electrolytic method for filling holes and cavities with metals

Device and method for electrolytically treating an at least superfi...

Patents Applicationslast 30 patents

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCU...

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

GALVANIC PROCESS FOR FILLING THROUGH-HOLES WITH METALS, IN PARTICUL...

Electrolytic Method For Filling Holes and Cavities With Metals

Galvanic process for filling through-holes with metals, in particul...

Method of electroplating a workpiece having high-aspect ratio holes

Device and method for electrolytically treating an at least superfi...