Berthold Schuderer

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having an identification mark
- Patent number 9,312,226
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 9,236,290
- Issue date Jan 12, 2016
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection region on a side wall of a semico...
- Patent number 8,753,982
- Issue date Jun 17, 2014
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor chip and semiconductor chip
- Patent number 8,637,967
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization for chip scale packages in wafer level packaging
- Patent number 8,163,629
- Issue date Apr 24, 2012
- Infineon Technologies AG
- Berthold Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling a contact hole and integrated circuit arrangemen...
- Patent number 7,825,510
- Issue date Nov 2, 2010
- Infineon Technologies AG
- Jürgen Förster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for contacting a device
- Patent number 7,816,791
- Issue date Oct 19, 2010
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, method for acquiring data and measurement system
- Patent number 7,660,175
- Issue date Feb 9, 2010
- Infineon Technologies AG
- Dieter Kohlert
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for filling a contact hole and integrated circuit arrangemen...
- Patent number 7,390,737
- Issue date Jun 24, 2008
- Infineon Technologies AG
- Jürgen Förster
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Producing a Semiconductor Device
- Publication number 20160086842
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having an Identification Mark
- Publication number 20140167272
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connection Region on a Side Wall of a Semico...
- Publication number 20120289047
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Device
- Publication number 20120289023
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Chip and Semiconductor Chip
- Publication number 20120119389
- Publication date May 17, 2012
- Markus Menath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization for Chip Scale Packages in Wafer Level Packaging
- Publication number 20120034760
- Publication date Feb 9, 2012
- Berthold Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit, Method for Acquiring Data and Measurement System
- Publication number 20090219773
- Publication date Sep 3, 2009
- Dieter Kohlert
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FILLING A CONTACT HOLE AND INTEGRATED CIRCUIT ARRANGEMEN...
- Publication number 20080136032
- Publication date Jun 12, 2008
- Infineon Technologies AG
- Jurgen Forster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Pad for Contacting a Device
- Publication number 20080067682
- Publication date Mar 20, 2008
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for filling a contact hole and integrated circuit arrangemen...
- Publication number 20060024946
- Publication date Feb 2, 2006
- Jurgen Forster
- H01 - BASIC ELECTRIC ELEMENTS

Berthold Schuderer

Person

Patents Grantslast 30 patents

Semiconductor device having an identification mark

Method for producing a semiconductor device

Method for producing a connection region on a side wall of a semico...

Method for fabricating a semiconductor chip and semiconductor chip

Metallization for chip scale packages in wafer level packaging

Method for filling a contact hole and integrated circuit arrangemen...

Bonding pad for contacting a device

Integrated circuit, method for acquiring data and measurement system

Method for filling a contact hole and integrated circuit arrangemen...

Patents Applicationslast 30 patents

Method for Producing a Semiconductor Device

Semiconductor Device Having an Identification Mark

Method for Producing a Connection Region on a Side Wall of a Semico...

Method for Producing a Semiconductor Device

Method for Fabricating a Semiconductor Chip and Semiconductor Chip

Metallization for Chip Scale Packages in Wafer Level Packaging

Integrated Circuit, Method for Acquiring Data and Measurement System

METHOD FOR FILLING A CONTACT HOLE AND INTEGRATED CIRCUIT ARRANGEMEN...

Bonding Pad for Contacting a Device

Method for filling a contact hole and integrated circuit arrangemen...