Beth M. Eichler

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Saint Paul, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Package comprising low application temperature hot melt adhesive co...
- Patent number 6,319,979
- Issue date Nov 20, 2001
- The Dow Chemical Company
- Robert A. Dubois
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low application temperature hot melt adhesive comprising ethylene ....
- Patent number 6,107,430
- Issue date Aug 22, 2000
- The Dow Chemical Company
- Robert A. Dubois
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...