Betty H. Yeung

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package thermal spreader having integrated EF/EMI shi...
- Patent number 11,935,809
- Issue date Mar 19, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having thermal dissipation feature and...
- Patent number 11,817,366
- Issue date Nov 14, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated RF/EMI shi...
- Patent number 11,557,525
- Issue date Jan 17, 2023
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with compact antenna formed using three-dimen...
- Patent number 11,121,467
- Issue date Sep 14, 2021
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of packaging an electronic device
- Patent number 9,054,111
- Issue date Jun 9, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die assemblies
- Patent number 7,989,951
- Issue date Aug 2, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Betty H. Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling warpage in redistributed chip packaging panels
- Patent number 7,950,144
- Issue date May 31, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Lakshmi N. Ramanathan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...
- Publication number 20230106555
- Publication date Apr 6, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...
- Publication number 20220384299
- Publication date Dec 1, 2022
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
- Publication number 20220344235
- Publication date Oct 27, 2022
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
- Publication number 20220181230
- Publication date Jun 9, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Compact Antenna Formed Using Three-Dimen...
- Publication number 20200403314
- Publication date Dec 24, 2020
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE
- Publication number 20100252919
- Publication date Oct 7, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ASSEMBLIES
- Publication number 20100142168
- Publication date Jun 10, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Betty H. Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING WARPAGE IN REDISTRIBUTED CHIP PACKAGING PANELS
- Publication number 20090271980
- Publication date Nov 5, 2009
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage-reducing packaging design
- Publication number 20070175660
- Publication date Aug 2, 2007
- Betty H. Yeung
- H01 - BASIC ELECTRIC ELEMENTS

Betty H. Yeung

Person

Patents Grantslast 30 patents

Semiconductor package thermal spreader having integrated EF/EMI shi...

Semiconductor device package having thermal dissipation feature and...

Semiconductor package thermal spreader having integrated RF/EMI shi...

Semiconductor package with compact antenna formed using three-dimen...

Electronic device and method of packaging an electronic device

Die assemblies

Method for controlling warpage in redistributed chip packaging panels

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...

SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...

Semiconductor Package with Compact Antenna Formed Using Three-Dimen...

ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE

DIE ASSEMBLIES

METHOD FOR CONTROLLING WARPAGE IN REDISTRIBUTED CHIP PACKAGING PANELS

Warpage-reducing packaging design