TREA

Beung-Seuck SONG

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  • Gyeonggi-do, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Stack package and stack packaging method
    • Patent number 7,863,715
    • Issue date Jan 4, 2011
    • Samsung Electronics Co., Ltd.
    • Sung-Hwan Yoon
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-chip package
    • Patent number 6,087,722
    • Issue date Jul 11, 2000
    • Samsung Electronics Co., Ltd.
    • Kwan Jai Lee
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents