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Bharatjeet Singh Gill
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Ottawa, CA
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Patents Grants
last 30 patents
Information
Patent Grant
Backside metalization with through-wafer-via processing to allow us...
Patent number
11,652,079
Issue date
May 16, 2023
Skyworks Solutions, Inc.
Bharatjeet Singh Gill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Auto-linearizing amplifier
Patent number
11,621,676
Issue date
Apr 4, 2023
Skyworks Solutions, Inc.
Mackenzie Brian Cook
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Direct substrate to solder bump connection for thermal management i...
Patent number
11,515,845
Issue date
Nov 29, 2022
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside metalization with through-wafer-via processing to allow us...
Patent number
11,171,110
Issue date
Nov 9, 2021
Skyworks Solutions, Inc.
Bharatjeet Singh Gill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct substrate to solder bump connection for thermal management i...
Patent number
10,790,788
Issue date
Sep 29, 2020
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip amplifier for wireless device
Patent number
10,447,210
Issue date
Oct 15, 2019
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Solder bump placement for thermal management in flip chip amplifiers
Patent number
10,193,504
Issue date
Jan 29, 2019
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Solder bump placement for grounding in flip chip amplifiers
Patent number
10,181,824
Issue date
Jan 15, 2019
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Solder bump placement for emitter-ballasting in flip chip amplifiers
Patent number
10,177,716
Issue date
Jan 8, 2019
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Direct substrate to solder bump connection for thermal management i...
Patent number
10,069,466
Issue date
Sep 4, 2018
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Circuits and methods related to low-noise amplifiers having improve...
Patent number
9,407,215
Issue date
Aug 2, 2016
Skyworks Solutions, Inc.
Bharatjeet Singh Gill
H03 - BASIC ELECTRONIC CIRCUITRY
Patents Applications
last 30 patents
Information
Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
Publication number
20230155555
Publication date
May 18, 2023
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AUTO-LINEARIZING AMPLIFIER
Publication number
20220190786
Publication date
Jun 16, 2022
Skyworks Solutions, Inc.
Mackenzie Brian Cook
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
BACKSIDE METALIZATION WITH THROUGH-WAFER-VIA PROCESSING TO ALLOW US...
Publication number
20210366868
Publication date
Nov 25, 2021
Skyworks Solutions, Inc.
Bharatjeet Singh Gill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
Publication number
20210119584
Publication date
Apr 22, 2021
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR THERMAL MANAGEMENT IN AMPLIFIERS
Publication number
20190199294
Publication date
Jun 27, 2019
SKYWORKS SOLUTIONS, INC.
Michael Joseph McPartlin
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
FLIP CHIP AMPLIFIER FOR WIRELESS DEVICE
Publication number
20190123693
Publication date
Apr 25, 2019
SKYWORKS SOLUTIONS, INC.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
Publication number
20190028067
Publication date
Jan 24, 2019
SKYWORKS SOLUTIONS, INC.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE METALIZATION WITH THROUGH-WAFER-VIA PROCESSING TO ALLOW US...
Publication number
20180315730
Publication date
Nov 1, 2018
SKYWORKS SOLUTIONS, INC.
Bharatjeet Singh Gill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BUMP PLACEMENT FOR GROUNDING IN FLIP CHIP AMPLIFIERS
Publication number
20170117857
Publication date
Apr 27, 2017
SKYWORKS SOLUTIONS, INC.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
Publication number
20170117853
Publication date
Apr 27, 2017
SKYWORKS SOLUTIONS, INC.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BUMP PLACEMENT FOR EMITTER-BALLASTING IN FLIP CHIP AMPLIFIERS
Publication number
20170117270
Publication date
Apr 27, 2017
SKYWORKS SOLUTIONS, INC.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BUMP PLACEMENT FOR THERMAL MANAGEMENT IN FLIP CHIP AMPLIFIERS
Publication number
20170117204
Publication date
Apr 27, 2017
SKYWORKS SOLUTIONS, INC.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUITS AND METHODS RELATED TO LOW-NOISE AMPLIFIERS HAVING IMPROVE...
Publication number
20140333384
Publication date
Nov 13, 2014
Bharatjeet Singh GILL
H03 - BASIC ELECTRONIC CIRCUITRY