Membership
Tour
Register
Log in
Bhola N. De
Follow
Person
Congers, NY, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Wafer demount receptable for separation of thinned wafer from mount...
Patent number
6,554,949
Issue date
Apr 29, 2003
Anadigics, Inc.
Bhola De
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer demount receptacle for separation of thinned wafer from mount...
Patent number
6,491,083
Issue date
Dec 10, 2002
Anadigics, Inc.
Bhola De
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer demount gas distribution tool
Patent number
6,470,946
Issue date
Oct 29, 2002
Anadigics, Inc.
Bhola De
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Spatula for separation of thinned wafer from mounting carrier
Patent number
6,415,843
Issue date
Jul 9, 2002
Anadigics, Inc.
Bhola De
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduced stress sputtering target and method of manufacturing therefor
Patent number
5,474,667
Issue date
Dec 12, 1995
Materials Research Corporation
Steven D. Hurwitt
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Self aligning in-situ ellipsometer and method of using for process...
Patent number
5,408,322
Issue date
Apr 18, 1995
Materials Research Corporation
Jon S. Hsu
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
Wafer demount receptacle for separation of thinned wafer from mount...
Publication number
20030015286
Publication date
Jan 23, 2003
Anadigics, Inc.
Bhola De
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer demount gas distribution tool
Publication number
20020104622
Publication date
Aug 8, 2002
Bhola De
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer demount receptacle for separation of thinned wafer from mount...
Publication number
20020104616
Publication date
Aug 8, 2002
Bhola De
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPATULA FOR SEPARATION OF THINNED WAFER FROM MOUNTING CARRIER
Publication number
20020088556
Publication date
Jul 11, 2002
Bhola De
H01 - BASIC ELECTRIC ELEMENTS