Membership
Tour
Register
Log in
Bhupender Singh
Follow
Person
Fishkill, NY, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
High bandwidth module
Patent number
11,756,930
Issue date
Sep 12, 2023
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Spacer for die-to-die communication in an integrated circuit and me...
Patent number
11,521,952
Issue date
Dec 6, 2022
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polygon integrated circuit (IC) packaging
Patent number
11,410,894
Issue date
Aug 9, 2022
International Business Machines Corporation
Charles L. Arvin
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Direct attachment of capacitors to flip chip dies
Patent number
11,404,365
Issue date
Aug 2, 2022
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment carrier for interconnect bridge assembly
Patent number
11,393,759
Issue date
Jul 19, 2022
International Business Machines Corporation
Thomas Weiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enlarged conductive pad structures for enhanced chip bond assembly...
Patent number
11,282,773
Issue date
Mar 22, 2022
International Business Machines Corporation
Krishna R. Tunga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic apparatus having inter-chip stiffener
Patent number
11,211,262
Issue date
Dec 28, 2021
International Business Machines Corporation
Tuhin Sinha
G11 - INFORMATION STORAGE
Information
Patent Grant
High bandwidth module
Patent number
11,201,136
Issue date
Dec 14, 2021
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Spacer for die-to-die communication in an integrated circuit
Patent number
11,031,373
Issue date
Jun 8, 2021
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fins for enhanced die communication
Patent number
11,031,343
Issue date
Jun 8, 2021
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked capacitors for use in integrated circuit modules and the like
Patent number
11,004,614
Issue date
May 11, 2021
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HIGH BANDWIDTH MODULE
Publication number
20220059499
Publication date
Feb 24, 2022
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENLARGED CONDUCTIVE PAD STRUCTURES FOR ENHANCED CHIP BOND ASSEMBLY...
Publication number
20210320056
Publication date
Oct 14, 2021
International Business Machines Corporation
Krishna R. Tunga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH BANDWIDTH MODULE
Publication number
20210288025
Publication date
Sep 16, 2021
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC APPARATUS HAVING INTER-CHIP STIFFENER
Publication number
20210225665
Publication date
Jul 22, 2021
International Business Machines Corporation
TUHIN SINHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
Publication number
20210175207
Publication date
Jun 10, 2021
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY
Publication number
20210104464
Publication date
Apr 8, 2021
International Business Machines Corporation
Thomas Weiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLYGON INTEGRATED CIRCUIT (IC) PACKAGING
Publication number
20210074599
Publication date
Mar 11, 2021
International Business Machines Corporation
Charles L. Arvin
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FINS FOR ENHANCED DIE COMMUNICATION
Publication number
20200402912
Publication date
Dec 24, 2020
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT ATTACHMENT OF CAPACITORS TO FLIP CHIP DIES
Publication number
20200357737
Publication date
Nov 12, 2020
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
Publication number
20200312812
Publication date
Oct 1, 2020
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CAPACITORS FOR USE IN INTEGRATED CIRCUIT MODULES AND THE LIKE
Publication number
20200185156
Publication date
Jun 11, 2020
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS