Bhuvaneshwaran Vijayakumar

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reduction of packaging substrate deformation
- Patent number 11,974,390
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Bhuvaneshwaran Vijayakumar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods and devices related to reduced packaging substrate deformation
- Patent number 11,596,056
- Issue date Feb 28, 2023
- Skyworks Solutions, Inc.
- Bhuvaneshwaran Vijayakumar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flip-chip amplifier with termination circuit
- Patent number 10,141,901
- Issue date Nov 27, 2018
- Skyworks Solutions, Inc.
- Guohao Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flip-chip linear power amplifier with high power added efficiency
- Patent number 9,467,940
- Issue date Oct 11, 2016
- Skyworks Solutions, Inc.
- Guohao Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING SUBSTRATES HAVING REDUCED DEFORMATION AND METHODS RELATED...
- Publication number 20240324095
- Publication date Sep 26, 2024
- Skyworks Solutions, Inc.
- Bhuvaneshwaran VIJAYAKUMAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HEAT TRANSFER FROM NON-GROUNDABLE ELECTRONIC COMPONENTS
- Publication number 20230268247
- Publication date Aug 24, 2023
- Skyworks Solutions, Inc.
- Bhuvaneshwaran Vijayakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING HEAT FROM UNGROUNDED ELECTRONIC COMPONENTS
- Publication number 20230269861
- Publication date Aug 24, 2023
- Skyworks Solutions, Inc.
- Bhuvaneshwaran Vijayakumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCTION OF PACKAGING SUBSTRATE DEFORMATION
- Publication number 20230262877
- Publication date Aug 17, 2023
- SKYWORKS SOLUTIONS, INC.
- Bhuvaneshwaran VIJAYAKUMAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS AND DEVICES RELATED TO REDUCED PACKAGING SUBSTRATE DEFORMATION
- Publication number 20200107433
- Publication date Apr 2, 2020
- SKYWORKS SOLUTIONS, INC.
- Bhuvaneshwaran VIJAYAKUMAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FLIP-CHIP AMPLIFIER WITH TERMINATION CIRCUIT
- Publication number 20160380603
- Publication date Dec 29, 2016
- SKYWORKS SOLUTIONS, INC.
- Guohao Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLIP-CHIP LINEAR POWER AMPLIFIER WITH HIGH POWER ADDED EFFICIENCY
- Publication number 20130130752
- Publication date May 23, 2013
- SKYWORKS SOLUTIONS, INC.
- Guohao Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Bhuvaneshwaran Vijayakumar

Person

Patents Grantslast 30 patents

Reduction of packaging substrate deformation

Methods and devices related to reduced packaging substrate deformation

Flip-chip amplifier with termination circuit

Flip-chip linear power amplifier with high power added efficiency

Patents Applicationslast 30 patents

PACKAGING SUBSTRATES HAVING REDUCED DEFORMATION AND METHODS RELATED...

HEAT TRANSFER FROM NON-GROUNDABLE ELECTRONIC COMPONENTS

METHOD OF TRANSFERRING HEAT FROM UNGROUNDED ELECTRONIC COMPONENTS

REDUCTION OF PACKAGING SUBSTRATE DEFORMATION

METHODS AND DEVICES RELATED TO REDUCED PACKAGING SUBSTRATE DEFORMATION

FLIP-CHIP AMPLIFIER WITH TERMINATION CIRCUIT

FLIP-CHIP LINEAR POWER AMPLIFIER WITH HIGH POWER ADDED EFFICIENCY