Bi-Ming Yen

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
In-situ photoresist strip during plasma etching of active hard mask
- Patent number 8,912,633
- Issue date Dec 16, 2014
- Lam Research Corporation
- Sangjun Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Uniform etch system
- Patent number 8,801,892
- Issue date Aug 12, 2014
- Lam Research Corporation
- Dean J. Larson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triode reactor design with multiple radiofrequency powers
- Patent number 8,652,298
- Issue date Feb 18, 2014
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ photoresist strip during plasma etching of active hard mask
- Patent number 8,283,255
- Issue date Oct 9, 2012
- Lam Research Corporation
- Sangjun Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for low-K dielectric etch with reduced damage
- Patent number 8,236,188
- Issue date Aug 7, 2012
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for wafer temperature verification in etch tools
- Patent number 7,951,616
- Issue date May 31, 2011
- Lam Research Corporation
- Keren J. Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lag control
- Patent number 7,789,991
- Issue date Sep 7, 2010
- Lam Research Corporation
- Binet A. Worsham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for silicon electrode assembly etch rate and etch uniformit...
- Patent number 7,442,114
- Issue date Oct 28, 2008
- Lam Research Corporation
- Tuochuan Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Uniform etch system
- Patent number 7,371,332
- Issue date May 13, 2008
- Lam Research Corporation
- Dean J. Larson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lag control
- Patent number 7,307,025
- Issue date Dec 11, 2007
- Lam Research Corporation
- Binet A. Worsham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferless automatic cleaning after barrier removal
- Patent number 7,211,518
- Issue date May 1, 2007
- Lam Research Corporation
- Xiaoqiang Sean Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas distribution system with tuning gas
- Patent number 7,169,231
- Issue date Jan 30, 2007
- Lam Research Corporation
- Dean J. Larson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for the optimization of substrate etching in a plasma proce...
- Patent number 7,078,350
- Issue date Jul 18, 2006
- Lam Research Corporation
- Jisoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively etching organosilicate glass with respect to...
- Patent number 7,041,230
- Issue date May 9, 2006
- Lam Research Corporation
- Xingcai Su
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Methods and apparatus for inspecting contact openings in a plasma p...
- Patent number 6,979,579
- Issue date Dec 27, 2005
- Lam Research Corporation
- Jisoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching a metal hard mask for an integrated circuit structure
- Patent number 6,930,048
- Issue date Aug 16, 2005
- Lam Research Corporation
- SiYi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable plasma volume etch chamber
- Patent number 6,527,911
- Issue date Mar 4, 2003
- Lam Research Corporation
- Bi-Ming Yen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRIODE REACTOR DESIGN WITH MULTIPLE RADIOFREQUENCY POWERS
- Publication number 20130126475
- Publication date May 23, 2013
- LAM RESEARCH CORPORATION
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU PHOTORESIST STRIP DURING PLASMA ETCHING OF ACTIVE HARD MASK
- Publication number 20130001754
- Publication date Jan 3, 2013
- LAM RESEARCH CORPORATION
- Sangjun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW-K DIELECTRIC ETCH WITH REDUCED DAMAGE
- Publication number 20100261352
- Publication date Oct 14, 2010
- LAM RESEARCH CORPORATION
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR WAFER TEMPERATURE VERIFICATION IN ETCH TOOLS
- Publication number 20100022033
- Publication date Jan 28, 2010
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of sputtering a protective coating on a semiconductor subs...
- Publication number 20090020417
- Publication date Jan 22, 2009
- Jisoo Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
In-situ photoresist strip during plasma etching of active hard mask
- Publication number 20080293249
- Publication date Nov 27, 2008
- Lam Research Corporation
- Sangjun Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
UNIFORM ETCH SYSTEM
- Publication number 20080210377
- Publication date Sep 4, 2008
- LAM RESEARCH CORPORATION
- Dean J. Larson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFERLESS AUTOMATIC CLEANING AFTER BARRIER REMOVAL
- Publication number 20070128849
- Publication date Jun 7, 2007
- LAM RESEARCH CORPORATION
- Xiaoqiang Sean Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for silicon electrode assembly etch rate and etch uniformit...
- Publication number 20060138081
- Publication date Jun 29, 2006
- Lam Research Corporation
- Tuochuan Huang
- B08 - CLEANING
Information Patent Application
Waferless automatic cleaning after barrier removal
- Publication number 20050233590
- Publication date Oct 20, 2005
- Lam Research Corporation
- Xiaoqiang Sean Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for the optimization of substrate etching in a plasma proce...
- Publication number 20050205519
- Publication date Sep 22, 2005
- Jisoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for selectively etching organosilicate glass with respect to...
- Publication number 20040140289
- Publication date Jul 22, 2004
- Lam Research Corporation
- Xingcai Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Uniform etch system
- Publication number 20040112540
- Publication date Jun 17, 2004
- Lam Research Corporation
- Dean J. Larson
- G05 - CONTROLLING REGULATING
Information Patent Application
Gas distribution system with tuning gas
- Publication number 20040112538
- Publication date Jun 17, 2004
- Lam Research Corporation
- Dean J. Larson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Uniform etch system
- Publication number 20040112539
- Publication date Jun 17, 2004
- Lam Research Corporation
- Dean J. Larson
- H01 - BASIC ELECTRIC ELEMENTS

Bi-Ming Yen

Person

Patents Grantslast 30 patents

In-situ photoresist strip during plasma etching of active hard mask

Uniform etch system

Triode reactor design with multiple radiofrequency powers

In-situ photoresist strip during plasma etching of active hard mask

Method for low-K dielectric etch with reduced damage

Process for wafer temperature verification in etch tools

Lag control

Methods for silicon electrode assembly etch rate and etch uniformit...

Uniform etch system

Lag control

Waferless automatic cleaning after barrier removal

Gas distribution system with tuning gas

Methods for the optimization of substrate etching in a plasma proce...

Method for selectively etching organosilicate glass with respect to...

Methods and apparatus for inspecting contact openings in a plasma p...

Etching a metal hard mask for an integrated circuit structure

Configurable plasma volume etch chamber

Patents Applicationslast 30 patents

TRIODE REACTOR DESIGN WITH MULTIPLE RADIOFREQUENCY POWERS

IN-SITU PHOTORESIST STRIP DURING PLASMA ETCHING OF ACTIVE HARD MASK

METHOD FOR LOW-K DIELECTRIC ETCH WITH REDUCED DAMAGE

PROCESS FOR WAFER TEMPERATURE VERIFICATION IN ETCH TOOLS

Methods of sputtering a protective coating on a semiconductor subs...

In-situ photoresist strip during plasma etching of active hard mask

UNIFORM ETCH SYSTEM

WAFERLESS AUTOMATIC CLEANING AFTER BARRIER REMOVAL

Methods for silicon electrode assembly etch rate and etch uniformit...

Waferless automatic cleaning after barrier removal

Methods for the optimization of substrate etching in a plasma proce...

Method for selectively etching organosilicate glass with respect to...

Uniform etch system

Gas distribution system with tuning gas

Uniform etch system