Biancun XIE

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Patents Grantslast 30 patents

Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package comprising a substrate and a multi-capacitor integrated pas...
- Patent number 11,749,661
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit (3D IC) power distribution net...
- Patent number 11,626,359
- Issue date Apr 11, 2023
- QUALCOMM Incorporated
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...
- Publication number 20240107665
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BRIDGE CONFIGURED FOR A BACK...
- Publication number 20230402380
- Publication date Dec 14, 2023
- QUALCOMM Incorporated
- Biancun XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND A MULTI-CAPACITOR INTEGRATED PAS...
- Publication number 20230005901
- Publication date Jan 5, 2023
- QUALCOMM Incorporated
- Biancun XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) POWER DISTRIBUTION NET...
- Publication number 20220344249
- Publication date Oct 27, 2022
- QUALCOMM Incorporated
- Biancun XIE
- H01 - BASIC ELECTRIC ELEMENTS