BIAO LI

Person

Shenzhen City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-parameter integrated test system for deep geothermal in-situ...
- Patent number 12,305,894
- Issue date May 20, 2025
- Shenzhen University
- Heping Xie
- G01 - MEASURING TESTING
Information Patent Grant
Anti-shake assembly and manufacturing method therefor, camera modul...
- Patent number 12,219,258
- Issue date Feb 4, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Cheng-Yi Yang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,082,352
- Issue date Sep 3, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 11,991,838
- Issue date May 21, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and method for manufacturing same
- Patent number 11,445,618
- Issue date Sep 13, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Text recommendation method and apparatus, and electronic device
- Patent number 11,182,564
- Issue date Nov 23, 2021
- Tencent Technology (Shenzhen) Company Limited
- Bingfeng Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible printed circuit board, method for manufacturing the same a...
- Patent number 11,057,709
- Issue date Jul 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Biao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an ultrathin heat dissipation structure
- Patent number 10,923,411
- Issue date Feb 16, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Ning Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bendable circuit board and method for manufacturing the same
- Patent number 10,863,620
- Issue date Dec 8, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing rigid-flexible circuit board
- Patent number 10,765,013
- Issue date Sep 1, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Biao Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flexible printed circuit board, method for manufacturing the same a...
- Patent number 10,524,057
- Issue date Dec 31, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Biao Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ultrathin heat dissipation structure
- Patent number 10,448,540
- Issue date Oct 15, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Ning Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making circuit board
- Patent number 10,383,223
- Issue date Aug 13, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Ning Hou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Embedded circuit board and method of making same
- Patent number 10,356,909
- Issue date Jul 16, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Ning Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for making the same
- Patent number 10,187,984
- Issue date Jan 22, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Ning Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple-input multiple-output antenna, system and mobile terminal
- Patent number 9,954,275
- Issue date Apr 24, 2018
- ZTE Corporation
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact rigid-flexible printed circuit board and method for manufac...
- Patent number 9,210,811
- Issue date Dec 8, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Biao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing rigid-flexible printed circuit board
- Patent number 9,198,304
- Issue date Nov 24, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Biao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240130050
- Publication date Apr 18, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NEGATIVE ELECTRODE MATERIAL, PREPARATION METHOD THEREOF, AND ALL-SO...
- Publication number 20230420663
- Publication date Dec 28, 2023
- BYD COMPANY LIMITED
- Biao LI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...
- Publication number 20230389170
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Limited.
- HUAN-YU HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-SHAKE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, CAMERA MODUL...
- Publication number 20230164441
- Publication date May 25, 2023
- Avary Holding (Shenzhen) Co., Limited.
- CHENG-YI YANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BATTERY ASSEMBLY, BATTERY MODULE, AND METHOD FOR MANUFACTURING THE...
- Publication number 20230155257
- Publication date May 18, 2023
- Avary Holding (Shenzhen) Co., Limited.
- JIN-CHENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20220361343
- Publication date Nov 10, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YAO-CAI LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220225512
- Publication date Jul 14, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- CHENG-YI YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20220167507
- Publication date May 26, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YAO-CAI LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NEGATIVE ELECTRODE MATERIAL AND PREPARATION METHOD THEREOF, NEGATIV...
- Publication number 20210296637
- Publication date Sep 23, 2021
- BYD COMPANY LIMITED
- Jing XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEXT RECOMMENDATION METHOD AND APPARATUS, AND ELECTRONIC DEVICE
- Publication number 20200242304
- Publication date Jul 30, 2020
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Bingfeng LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED CIRCUIT BOARD AND METHOD OF MAKING SAME
- Publication number 20200120805
- Publication date Apr 16, 2020
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING AN ULTRATHIN HEAT DISSIPATION STRUCTURE
- Publication number 20190320550
- Publication date Oct 17, 2019
- Avary Holding (Shenzhen) Co., Limited.
- NING HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME A...
- Publication number 20190281392
- Publication date Sep 12, 2019
- Avary Holding (Shenzhen) Co., Limited.
- BIAO LI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MAKING CIRCUIT BOARD
- Publication number 20190098754
- Publication date Mar 28, 2019
- Avary Holding (Shenzhen) Co., Limited.
- NING HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING RIGID-FLEXIBLE CIRCUIT BOARD
- Publication number 20190069418
- Publication date Feb 28, 2019
- Avary Holding (Shenzhen) Co., Limited.
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME A...
- Publication number 20190007774
- Publication date Jan 3, 2019
- Avary Holding (Shenzhen) Co., Limited.
- BIAO LI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ULTRATHIN HEAT DISSIPATION STRUCTURE AND A METHOD FOR MANUFACTURING...
- Publication number 20170325356
- Publication date Nov 9, 2017
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- NING HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multiple-input multiple-output antenna, system and mobile terminal
- Publication number 20150255864
- Publication date Sep 10, 2015
- ZTE CORPORATION
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFAC...
- Publication number 20140305683
- Publication date Oct 16, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140182899
- Publication date Jul 3, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20120260501
- Publication date Oct 18, 2012
- ZHEN DING TECHNOLOGY CO., LTD.
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Multi-parameter integrated test system for deep geothermal in-situ...

Anti-shake assembly and manufacturing method therefor, camera modul...

Embedded circuit board and manufacturing method thereof

Circuit board using thermocouple to dissipate generated heat and me...

Flexible circuit board

Embedded circuit board and manufacturing method thereof

Flexible circuit board and method for manufacturing same

Text recommendation method and apparatus, and electronic device

Flexible printed circuit board, method for manufacturing the same a...

Method for manufacturing an ultrathin heat dissipation structure

Bendable circuit board and method for manufacturing the same

Method for manufacturing rigid-flexible circuit board

Flexible printed circuit board, method for manufacturing the same a...

Ultrathin heat dissipation structure

Method for making circuit board

Embedded circuit board and method of making same

Circuit board and method for making the same

Multiple-input multiple-output antenna, system and mobile terminal

Compact rigid-flexible printed circuit board and method for manufac...

Method for manufacturing rigid-flexible printed circuit board

Patents Applicationslast 30 patents

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

NEGATIVE ELECTRODE MATERIAL, PREPARATION METHOD THEREOF, AND ALL-SO...

CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...

ANTI-SHAKE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, CAMERA MODUL...

BATTERY ASSEMBLY, BATTERY MODULE, AND METHOD FOR MANUFACTURING THE...

FLEXIBLE CIRCUIT BOARD

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

NEGATIVE ELECTRODE MATERIAL AND PREPARATION METHOD THEREOF, NEGATIV...

TEXT RECOMMENDATION METHOD AND APPARATUS, AND ELECTRONIC DEVICE

EMBEDDED CIRCUIT BOARD AND METHOD OF MAKING SAME

METHOD FOR MANUFACTURING AN ULTRATHIN HEAT DISSIPATION STRUCTURE

FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME A...

METHOD FOR MAKING CIRCUIT BOARD

METHOD FOR MANUFACTURING RIGID-FLEXIBLE CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME A...

ULTRATHIN HEAT DISSIPATION STRUCTURE AND A METHOD FOR MANUFACTURING...

Multiple-input multiple-output antenna, system and mobile terminal

COMPACT RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFAC...

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD