Bidyut Sen

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Composite connector carrying power, electro-optical data, and fluid...
- Patent number 12,158,616
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Anant Thakar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor socket bridge for input/output extension
- Patent number 11,604,755
- Issue date Mar 14, 2023
- Cisco Technology, Inc.
- Jayaprakash Balachandran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect method for implementing scale-up servers
- Patent number 10,491,701
- Issue date Nov 26, 2019
- Cisco Technology, Inc.
- Victor Odisho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Micro-link high-bandwidth chip-to-chip bus
- Patent number 8,898,365
- Issue date Nov 25, 2014
- Oracle International Corporation
- Robert P. Masleid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for electrically coupling a semiconductor package to a pr...
- Patent number 8,116,097
- Issue date Feb 14, 2012
- Oracle America, Inc.
- David G. Love
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ternary alloy column grid array
- Patent number 7,754,343
- Issue date Jul 13, 2010
- Oracle America, Inc.
- David Love
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanism for determining an accelerated test specification for dev...
- Patent number 7,571,059
- Issue date Aug 4, 2009
- Sun Microsystems, Inc.
- Ron Zhang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Conformal heat spreader
- Patent number 7,007,741
- Issue date Mar 7, 2006
- Sun Microsystems, Inc.
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI grounding pins for CPU/ASIC chips
- Patent number 6,956,285
- Issue date Oct 18, 2005
- Sun Microsystems, Inc.
- Sergiu Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to test power distribution system
- Patent number 6,925,616
- Issue date Aug 2, 2005
- Sun Microsystems, Inc.
- Leesa Noujeim
- G01 - MEASURING TESTING
Information Patent Grant
Multipoint plane measurement probe and methods of characterization...
- Patent number 6,894,513
- Issue date May 17, 2005
- Sun Microsystems, Inc.
- Bidyut Sen
- G01 - MEASURING TESTING
Information Patent Grant
Method of emulating an ideal transformer valid from DC to infinite...
- Patent number 6,754,616
- Issue date Jun 22, 2004
- Fujitsu Limited
- Bidyut K. Sen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Efficient device debug system
- Patent number 6,472,900
- Issue date Oct 29, 2002
- Sun Microsystems, Inc.
- Deviprasad Malladi
- G01 - MEASURING TESTING
Information Patent Grant
Discrete silicon capacitor
- Patent number 6,252,760
- Issue date Jun 26, 2001
- Sun Microsystems, Inc.
- Bidyut Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient debug package design
- Patent number 6,246,252
- Issue date Jun 12, 2001
- Sun Microsystems, Inc.
- Deviprasad Malladi
- G01 - MEASURING TESTING
Information Patent Grant
High-yield methods of fabricating large substrate capacitors
- Patent number 5,817,533
- Issue date Oct 6, 1998
- Fujitsu Limited
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for controlling power consumption in integrated circuits
- Patent number 5,701,071
- Issue date Dec 23, 1997
- Fujitsu Limited
- Jiunn-Yau Liou
- G05 - CONTROLLING REGULATING
Information Patent Grant
Multilayer IC semiconductor package
- Patent number 5,414,222
- Issue date May 9, 1995
- LSI Logic Corporation
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer IC semiconductor package
- Patent number 5,304,743
- Issue date Apr 19, 1994
- LSI Logic Corporation
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of making such a package
- Patent number 5,173,766
- Issue date Dec 22, 1992
- LSI Logic Corporation
- Jon M. Long
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE CONNECTOR CARRYING POWER, ELECTRO-OPTICAL DATA, AND FLUID...
- Publication number 20240427088
- Publication date Dec 26, 2024
- Cisco Technology, Inc.
- Anant Thakar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE CONNECTOR CARRYING POWER, ELECTRO-OPTICAL DATA, AND FLUID...
- Publication number 20230185029
- Publication date Jun 15, 2023
- Cisco Technology, Inc.
- Anant Thakar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSOR SOCKET BRIDGE FOR INPUT/OUTPUT EXTENSION
- Publication number 20220292041
- Publication date Sep 15, 2022
- Cisco Technology, Inc.
- Jayaprakash Balachandran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID IO FABRIC ARCHITECTURE FOR MULTINODE SERVERS
- Publication number 20190075158
- Publication date Mar 7, 2019
- Cisco Technology, Inc.
- Yang Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT METHOD FOR IMPLEMENTING SCALE-UP SERVERS
- Publication number 20180019953
- Publication date Jan 18, 2018
- Cisco Technology, Inc.
- Victor Odisho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICRO-LINK HIGH-BANDWIDTH CHIP-TO-CHIP BUS
- Publication number 20130254448
- Publication date Sep 26, 2013
- Oracle International Corporation
- Robert P. Masleid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ELECTRICALLY COUPLING A SEMICONDUCTOR PACKAGE TO A PR...
- Publication number 20090113698
- Publication date May 7, 2009
- David G. Love
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mechanism for determining an accelerated test specification for dev...
- Publication number 20080004826
- Publication date Jan 3, 2008
- Ron Zhang
- G05 - CONTROLLING REGULATING
Information Patent Application
Thermal expansion compensation graded IC package
- Publication number 20070080441
- Publication date Apr 12, 2007
- Scott Kirkman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grid array package using tin/silver columns
- Publication number 20070059548
- Publication date Mar 15, 2007
- Sun Microsystems, Inc.
- David G. Love
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Ternary alloy column grid array
- Publication number 20070042211
- Publication date Feb 22, 2007
- Sun Microsystems, Inc.
- David Love
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multipoint plane measurement probe and methods of characterization...
- Publication number 20040145385
- Publication date Jul 29, 2004
- Sun Microsystems, Inc.
- Bidyut Sen
- G01 - MEASURING TESTING
Information Patent Application
EMI grounding pins for CPU/ASIC chips
- Publication number 20040135238
- Publication date Jul 15, 2004
- Sergiu Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal heat spreader
- Publication number 20040074630
- Publication date Apr 22, 2004
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to test power distribution system
- Publication number 20040068700
- Publication date Apr 8, 2004
- Leesa Noujeim
- G01 - MEASURING TESTING
Information Patent Application
WINDOWFRAME CAPACITOR
- Publication number 20030107116
- Publication date Jun 12, 2003
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Composite connector carrying power, electro-optical data, and fluid...

Processor socket bridge for input/output extension

Interconnect method for implementing scale-up servers

Micro-link high-bandwidth chip-to-chip bus

Apparatus for electrically coupling a semiconductor package to a pr...

Ternary alloy column grid array

Mechanism for determining an accelerated test specification for dev...

Conformal heat spreader

EMI grounding pins for CPU/ASIC chips

Method to test power distribution system

Multipoint plane measurement probe and methods of characterization...

Method of emulating an ideal transformer valid from DC to infinite...

Efficient device debug system

Discrete silicon capacitor

Efficient debug package design

High-yield methods of fabricating large substrate capacitors

Systems for controlling power consumption in integrated circuits

Multilayer IC semiconductor package

Multilayer IC semiconductor package

Semiconductor device package and method of making such a package

Patents Applicationslast 30 patents

COMPOSITE CONNECTOR CARRYING POWER, ELECTRO-OPTICAL DATA, AND FLUID...

COMPOSITE CONNECTOR CARRYING POWER, ELECTRO-OPTICAL DATA, AND FLUID...

PROCESSOR SOCKET BRIDGE FOR INPUT/OUTPUT EXTENSION

HYBRID IO FABRIC ARCHITECTURE FOR MULTINODE SERVERS

INTERCONNECT METHOD FOR IMPLEMENTING SCALE-UP SERVERS

MICRO-LINK HIGH-BANDWIDTH CHIP-TO-CHIP BUS

APPARATUS FOR ELECTRICALLY COUPLING A SEMICONDUCTOR PACKAGE TO A PR...

Mechanism for determining an accelerated test specification for dev...

Thermal expansion compensation graded IC package

Grid array package using tin/silver columns

Ternary alloy column grid array

Multipoint plane measurement probe and methods of characterization...

EMI grounding pins for CPU/ASIC chips

Conformal heat spreader

Method to test power distribution system

WINDOWFRAME CAPACITOR