Bigildis Dosdos

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 11,735,508
- Issue date Aug 22, 2023
- SEMICONDUCTOR COMONENTS INDUTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 11,177,203
- Issue date Nov 16, 2021
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor assembly with dual middle mounting clips
- Patent number 11,075,148
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies
- Patent number 11,004,777
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 10,256,178
- Issue date Apr 9, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common drain power clip for battery pack protection mosfet
- Patent number 9,379,045
- Issue date Jun 28, 2016
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module power clip
- Patent number 8,723,300
- Issue date May 13, 2014
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical MOSFET transistor having source/drain contacts disposed on...
- Patent number 8,487,371
- Issue date Jul 16, 2013
- Fairchild Semiconductor Corporation
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 8,193,043
- Issue date Jun 5, 2012
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module for battery power control
- Patent number 8,003,447
- Issue date Aug 23, 2011
- Fairchild Semiconductor Corporation
- Jeongil Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-chip module for battery power control
- Patent number 7,868,432
- Issue date Jan 11, 2011
- Fairchild Semiconductor Corporation
- Jeongil Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 7,800,219
- Issue date Sep 21, 2010
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20220238421
- Publication date Jul 28, 2022
- Semiconductor Components Industries, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20220059443
- Publication date Feb 24, 2022
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS
- Publication number 20210111106
- Publication date Apr 15, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20200411421
- Publication date Dec 31, 2020
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20190181083
- Publication date Jun 13, 2019
- Fairchild Semiconductor Corporation
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20180068935
- Publication date Mar 8, 2018
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON DRAIN POWER CLIP FOR BATTERY PACK PROTECTION MOSFET
- Publication number 20140070392
- Publication date Mar 13, 2014
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE POWER CLIP
- Publication number 20140042599
- Publication date Feb 13, 2014
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE FOR BATTERY POWER CONTROL
- Publication number 20110078899
- Publication date Apr 7, 2011
- Jeongil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAP...
- Publication number 20110059580
- Publication date Mar 10, 2011
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS
- Publication number 20090261461
- Publication date Oct 22, 2009
- Steven Sapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Power Semiconductor Die Packages With Integrated Heat-Sink Cap...
- Publication number 20090166850
- Publication date Jul 2, 2009
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE FOR BATTERY POWER CONTROL
- Publication number 20070187807
- Publication date Aug 16, 2007
- Jeongil Lee
- H01 - BASIC ELECTRIC ELEMENTS

Bigildis Dosdos

Person

Patents Grantslast 30 patents

Molded packaging for wide band gap semiconductor devices

Vertical and horizontal circuit assemblies

Vertical and horizontal circuit assemblies

Stacked transistor assembly with dual middle mounting clips

Semiconductor device assemblies

Vertical and horizontal circuit assemblies

Common drain power clip for battery pack protection mosfet

Multi-chip module power clip

Vertical MOSFET transistor having source/drain contacts disposed on...

High-power semiconductor die packages with integrated heat-sink cap...

Multi-chip module for battery power control

Multi-chip module for battery power control

High-power semiconductor die packages with integrated heat-sink cap...

Patents Applicationslast 30 patents

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS

SEMICONDUCTOR DEVICE ASSEMBLIES

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

COMMON DRAIN POWER CLIP FOR BATTERY PACK PROTECTION MOSFET

MULTI-CHIP MODULE POWER CLIP

MULTI-CHIP MODULE FOR BATTERY POWER CONTROL

HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAP...

SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS

High-Power Semiconductor Die Packages With Integrated Heat-Sink Cap...

MULTI-CHIP MODULE FOR BATTERY POWER CONTROL