Bih-Tiao Lin

Person

Ping-Tung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Post-CMP cleaning system
- Patent number 7,685,667
- Issue date Mar 30, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bih-tiao Lin
- B08 - CLEANING
Information Patent Grant
Dynamically adjustable slurry feed arm for wafer edge profile impro...
- Patent number 6,821,895
- Issue date Nov 23, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bih-Tiao Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing method for fabricating copper damasce...
- Patent number 6,660,629
- Issue date Dec 9, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bih-Tiao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry dilution system with an ultrasonic vibrator capable of in-si...
- Patent number 6,604,849
- Issue date Aug 12, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bih-Tiao Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Method of fabricating copper damascene
- Patent number 6,524,950
- Issue date Feb 25, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bih-Tiao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone conditioner for chemical mechanical polishing system
- Patent number 6,343,977
- Issue date Feb 5, 2002
- Worldwide Semiconductor Manufacturing Corp.
- Shuang-Neng Peng
- B24 - GRINDING POLISHING
Information Patent Grant
Method of planarization
- Patent number 6,277,751
- Issue date Aug 21, 2001
- Worldwide Semiconductor Manufacturing Corp.
- Pao-Kang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating shallow trench isolation structure
- Patent number 6,218,307
- Issue date Apr 17, 2001
- Taiwan Semiconductor Mfg. Co., Ltd.
- Bih-Tiao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of finely controlled shallow trench isolation for ULSI pr...
- Patent number 6,180,489
- Issue date Jan 30, 2001
- Vanguard International Semiconductor Corporation
- Fu-Liang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for eliminating CMP induced microscratches
- Patent number 6,140,240
- Issue date Oct 31, 2000
- Vanguard International Semiconductor Corporation
- Fu-Liang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Powder-proof apparatus for a PECVD reactor chamber
- Patent number 6,089,969
- Issue date Jul 18, 2000
- Vanguard International Semiconductor Corporation
- Min-Yuan Chung
- B08 - CLEANING
Information Patent Grant
Method for simultaneously fabricating a DRAM capacitor and metal in...
- Patent number 6,071,789
- Issue date Jun 6, 2000
- Vanguard International Semiconductor Corporation
- Fu-Liang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing pad with controlled polish rate
- Patent number 6,054,017
- Issue date Apr 25, 2000
- Vanguard International Semiconductor Corporation
- Fu-Liang Yang
- B24 - GRINDING POLISHING
Information Patent Grant
Method for forming identifying characters on a silicon wafer
- Patent number 6,037,259
- Issue date Mar 14, 2000
- Vanguard International Semiconductor Corporation
- Bih-Tiao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for polishing and cleaning a wafer
- Patent number 5,888,124
- Issue date Mar 30, 1999
- Vanguard International Semiconductor Corporation
- Bih-Tiao Lin
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
Post-CMP cleaning system
- Publication number 20060277702
- Publication date Dec 14, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bih-tiao Lin
- B08 - CLEANING
Information Patent Application
Reverse electroplating for damascene conductive region formation
- Publication number 20040235297
- Publication date Nov 25, 2004
- Bih-Tiao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dynamically adjustable slurry feed arm for wafer edge profile impro...
- Publication number 20040166686
- Publication date Aug 26, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bih-Tiao Lin
- B24 - GRINDING POLISHING
Information Patent Application
Fabrication method of shallow trench isolation
- Publication number 20020137305
- Publication date Sep 26, 2002
- Bih-Tiao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD FOR FABRICATING COOPER DAMASCE...
- Publication number 20020098675
- Publication date Jul 25, 2002
- Bih-Tiao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry dilution system with an ultrasonic vibrator capable of in-si...
- Publication number 20020048214
- Publication date Apr 25, 2002
- Bih-Tiao Lin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Bih-Tiao Lin

Person

Patents Grantslast 30 patents

Post-CMP cleaning system

Dynamically adjustable slurry feed arm for wafer edge profile impro...

Chemical mechanical polishing method for fabricating copper damasce...

Slurry dilution system with an ultrasonic vibrator capable of in-si...

Method of fabricating copper damascene

Multi-zone conditioner for chemical mechanical polishing system

Method of planarization

Method of fabricating shallow trench isolation structure

Formation of finely controlled shallow trench isolation for ULSI pr...

Method for eliminating CMP induced microscratches

Powder-proof apparatus for a PECVD reactor chamber

Method for simultaneously fabricating a DRAM capacitor and metal in...

Chemical mechanical polishing pad with controlled polish rate

Method for forming identifying characters on a silicon wafer

Apparatus for polishing and cleaning a wafer

Patents Applicationslast 30 patents

Post-CMP cleaning system

Reverse electroplating for damascene conductive region formation

Dynamically adjustable slurry feed arm for wafer edge profile impro...

Fabrication method of shallow trench isolation

CHEMICAL MECHANICAL POLISHING METHOD FOR FABRICATING COOPER DAMASCE...

Slurry dilution system with an ultrasonic vibrator capable of in-si...