Bih Wen Fon

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Chip scale packages and related methods
- Patent number 9,281,258
- Issue date Mar 8, 2016
- Semiconductor Components Industries, LLC
- Bih Wen Fon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-lead package and method of forming
- Patent number 9,018,044
- Issue date Apr 28, 2015
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-lead package and method of forming
- Patent number 8,759,978
- Issue date Jun 24, 2014
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20170162742
- Publication date Jun 8, 2017
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20160111581
- Publication date Apr 21, 2016
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-LEAD PACKAGE AND METHOD OF FORMING
- Publication number 20140248747
- Publication date Sep 4, 2014
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-LEAD PACKAGE AND METHOD OF FORMING
- Publication number 20130168866
- Publication date Jul 4, 2013
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS