Bijoyraj Sahu

Person

Gainsville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible and modular top and bottom side processor unit module cooling
- Patent number 12,055,986
- Issue date Aug 6, 2024
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Scalable debris-free socket loading mechanism
- Patent number 11,387,163
- Issue date Jul 12, 2022
- Intel Corporation
- Andrew Larson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular thermal energy management designs for data center computing
- Patent number 11,032,941
- Issue date Jun 8, 2021
- Intel Corporation
- Minh Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical seal and reservoir for microelectronic packages
- Patent number 10,418,309
- Issue date Sep 17, 2019
- Intel Corporation
- Bijoyraj Sahu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printhead with nanotips for nanoscale printing and manufacturing
- Patent number 9,889,653
- Issue date Feb 13, 2018
- Xerox Corporation
- Peter J. Nystrom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printhead with nanotips for nanoscale printing and manufacturing
- Patent number 9,038,269
- Issue date May 26, 2015
- Xerox Corporation
- Peter J. Nystrom
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Laser transmission laminating of materials for ink jet printheads
- Patent number 8,931,879
- Issue date Jan 13, 2015
- Xerox Corporation
- Peter J Nystrom
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Ultrasonic laminating of materials for ink jet printheads
- Patent number 8,919,915
- Issue date Dec 30, 2014
- Xerox Corporation
- Peter J. Nystrom
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonded silicon structure for high density print head
- Patent number 8,727,508
- Issue date May 20, 2014
- Xerox Corporation
- Peter J Nystrom
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING
- Publication number 20240345639
- Publication date Oct 17, 2024
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...
- Publication number 20230197622
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING DIES WITH BACKSIDE BACK-END-OF-LI...
- Publication number 20220415742
- Publication date Dec 29, 2022
- Intel Corporation
- Bijoyraj Sahu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS
- Publication number 20220196507
- Publication date Jun 23, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR SEALED LIQUID COOLING SYSTEM
- Publication number 20210321526
- Publication date Oct 14, 2021
- Devdatta Prakash Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING
- Publication number 20210208647
- Publication date Jul 8, 2021
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VARIABLE CONDUCTANCE HEAT PIPES FOR IMPROVED RELIABILITY
- Publication number 20210108860
- Publication date Apr 15, 2021
- Devdatta Prakash Kulkarni
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...
- Publication number 20190306985
- Publication date Oct 3, 2019
- Shelby A. Ferguson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCALABLE DEBRIS-FREE SOCKET LOADING MECHANISM
- Publication number 20190304869
- Publication date Oct 3, 2019
- Intel Corporation
- Andrew Larson
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
MODULAR THERMAL ENERGY MANAGEMENT DESIGNS FOR DATA CENTER COMPUTING
- Publication number 20190223324
- Publication date Jul 18, 2019
- Intel Corporation
- Minh Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTHEAD WITH NANOTIPS FOR NANOSCALE PRINTING AND MANUFACTURING
- Publication number 20150217568
- Publication date Aug 6, 2015
- Xerox Corporation
- Peter J. Nystrom
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD WITH NANOTIPS FOR NANOSCALE PRINTING AND MANUFACTURING
- Publication number 20140295064
- Publication date Oct 2, 2014
- Xerox Corporation
- Peter J. Nystrom
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LASER TRANSMISSION LAMINATING OF MATERIALS FOR INK JET PRINTHEADS
- Publication number 20130215185
- Publication date Aug 22, 2013
- Xerox Corporation
- Peter J. Nystrom
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ULTRASONIC LAMINATING OF MATERIALS FOR INK JET PRINTHEADS
- Publication number 20130215186
- Publication date Aug 22, 2013
- Xerox Corporation
- Peter J. Nystrom
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDED SILICON STRUCTURE FOR HIGH DENSITY PRINT HEAD
- Publication number 20130120505
- Publication date May 16, 2013
- Xerox Corporation
- Peter J. Nystrom
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Bijoyraj Sahu

Person

Patents Grantslast 30 patents

Flexible and modular top and bottom side processor unit module cooling

Scalable debris-free socket loading mechanism

Server microprocessor carrier with guiding alignment anti-tilt and...

Modular thermal energy management designs for data center computing

Mechanical seal and reservoir for microelectronic packages

Printhead with nanotips for nanoscale printing and manufacturing

Printhead with nanotips for nanoscale printing and manufacturing

Laser transmission laminating of materials for ink jet printheads

Ultrasonic laminating of materials for ink jet printheads

Bonded silicon structure for high density print head

Patents Applicationslast 30 patents

FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...

MICROELECTRONIC ASSEMBLIES HAVING DIES WITH BACKSIDE BACK-END-OF-LI...

LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS

TECHNOLOGIES FOR SEALED LIQUID COOLING SYSTEM

FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING

VARIABLE CONDUCTANCE HEAT PIPES FOR IMPROVED RELIABILITY

SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...

SCALABLE DEBRIS-FREE SOCKET LOADING MECHANISM

MODULAR THERMAL ENERGY MANAGEMENT DESIGNS FOR DATA CENTER COMPUTING

PRINTHEAD WITH NANOTIPS FOR NANOSCALE PRINTING AND MANUFACTURING

PRINTHEAD WITH NANOTIPS FOR NANOSCALE PRINTING AND MANUFACTURING

LASER TRANSMISSION LAMINATING OF MATERIALS FOR INK JET PRINTHEADS

ULTRASONIC LAMINATING OF MATERIALS FOR INK JET PRINTHEADS

BONDED SILICON STRUCTURE FOR HIGH DENSITY PRINT HEAD