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Hsinchu, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Protected solder ball joints in wafer level chip-scale packaging
Patent number
9,136,211
Issue date
Sep 15, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protected solder ball joints in wafer level chip-scale packaging
Patent number
8,492,263
Issue date
Jul 23, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package packaging for minimizing bond wire contamination...
Patent number
8,217,520
Issue date
Jul 10, 2012
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package packaging for minimizing bond wire contamination...
Patent number
7,719,122
Issue date
May 18, 2010
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad design to minimize dielectric cracking
Patent number
7,679,180
Issue date
Mar 16, 2010
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder bump structure and method of manufacturing same
Patent number
7,659,632
Issue date
Feb 9, 2010
Taiwan Seminconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging
Publication number
20130299984
Publication date
Nov 14, 2013
Chung Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM-IN-PACKAGE PACKAGING FOR MINIMIZING BOND WIRE CONTAMINATION...
Publication number
20100164091
Publication date
Jul 1, 2010
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging
Publication number
20090130840
Publication date
May 21, 2009
Chung Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System-in-package packaging for minimizing bond wire contamination...
Publication number
20080169557
Publication date
Jul 17, 2008
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder bump structure and method of manufacturing same
Publication number
20080122086
Publication date
May 29, 2008
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NOVEL BOND PAD DESIGN TO MINIMIZE DIELECTRIC CRACKING
Publication number
20080122100
Publication date
May 29, 2008
Taiwan Semiconductor Manufacturing Co., LTD
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS