Bin Li

Follow

Person

Andover, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for wafer-level chip scale package testing
- Patent number 9,676,619
- Issue date Jun 13, 2017
- MEMSIC SEMICONDUCTOR (WUXI) CO., LTD.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Method For Wafer-Level Chip Scale Package Testing
- Publication number 20170113929
- Publication date Apr 27, 2017
- Memsic Semiconductor (Wuxi) Co., Ltd.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Magnetic Field Sensor With Integrated Self-Test Reset Wire
- Publication number 20170115360
- Publication date Apr 27, 2017
- Memsic Semiconductor (Wuxi) Co., Ltd.
- Leyue Jiang
- G01 - MEASURING TESTING