Bin Lian

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microplates, reaction modules and detection systems
- Patent number 8,968,684
- Issue date Mar 3, 2015
- Bin Lian
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board with added impedance
- Patent number 7,057,114
- Issue date Jun 6, 2006
- Intel Corporation
- Terry Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with components embedded in backside diamond l...
- Patent number 6,913,999
- Issue date Jul 5, 2005
- Intel Corporation
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallurgically enhanced heat sink
- Patent number 6,797,085
- Issue date Sep 28, 2004
- Intel Corporation
- Terrance Dishongh
- C21 - METALLURGY OF IRON
Information Patent Grant
Surface mount connector lead
- Patent number 6,774,310
- Issue date Aug 10, 2004
- Intel Corporation
- Terrance J. Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with added impedance
- Patent number 6,775,122
- Issue date Aug 10, 2004
- Intel Corporation
- Terry Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Iodine-containing thermal interface material
- Patent number 6,752,204
- Issue date Jun 22, 2004
- Intel Corporation
- Terrance J. Dishongh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrically modifiable product labeling
- Patent number 6,731,221
- Issue date May 4, 2004
- Intel Corporation
- Terrance J. Dioshongh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fluorescence emission ratio imaging thermography for use in heat tr...
- Patent number 6,648,506
- Issue date Nov 18, 2003
- Board of Trustees of Michigan State University
- John J. McGrath
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with components embedded in backside diamond l...
- Patent number 6,649,937
- Issue date Nov 18, 2003
- Intel Corporation
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to read output information from a backside of...
- Patent number 6,624,643
- Issue date Sep 23, 2003
- Intel Corporation
- Terrence J. Dishongh
- G01 - MEASURING TESTING
Information Patent Grant
Vapor chamber active heat sink
- Patent number 6,550,531
- Issue date Apr 22, 2003
- Intel Corporation
- Damion T. Searls
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Process for local on-chip cooling of semiconductor devices using bu...
- Patent number 6,521,516
- Issue date Feb 18, 2003
- Intel Corporation
- Franklin G. Monzon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit card assembly having controlled vibrational properties
- Patent number 6,486,589
- Issue date Nov 26, 2002
- Intel Corporation
- Prateek Dujari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit card assembly having controlled expansion properties
- Patent number 6,359,372
- Issue date Mar 19, 2002
- Intel Corporation
- Prateek Dujari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink with integrated fluid circulation pump
- Patent number 6,327,145
- Issue date Dec 4, 2001
- Intel Corporation
- Bin Lian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Microplates, Reaction Modules and Detection Systems
- Publication number 20120276541
- Publication date Nov 1, 2012
- Bin Lian
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Circuit board with added impedance
- Publication number 20040057184
- Publication date Mar 25, 2004
- Terry Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with components embedded in backside diamond l...
- Publication number 20040056272
- Publication date Mar 25, 2004
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically modifiable product labeling
- Publication number 20040017295
- Publication date Jan 29, 2004
- Terrance J. Dishongh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPONENTS EMBEDDED IN BACKSIDE DIAMOND L...
- Publication number 20030183823
- Publication date Oct 2, 2003
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluorescence emission ratio imaging thermography for use in heat tr...
- Publication number 20030128737
- Publication date Jul 10, 2003
- Board of Trustees operating Michigan State University
- John J. McGrath
- G01 - MEASURING TESTING
Information Patent Application
Self-powered wireless device
- Publication number 20030080938
- Publication date May 1, 2003
- Bin Lian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Iodine-containing thermal interface material
- Publication number 20030051868
- Publication date Mar 20, 2003
- Terrance J. Dishongh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Ergonomic auxiliary screen and display subsystem for portable handh...
- Publication number 20030006942
- Publication date Jan 9, 2003
- Damion Searls
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESS FOR LOCAL ON-CHIP COOLING OF SEMICONDUCTOR DEVICES USING BU...
- Publication number 20030003698
- Publication date Jan 2, 2003
- Franklin G. Monzon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipation device
- Publication number 20020118511
- Publication date Aug 29, 2002
- Prateek J. Dujari
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Apparatus and method to read output information from a backside of...
- Publication number 20020070739
- Publication date Jun 13, 2002
- Terrence J. Dishongh
- G01 - MEASURING TESTING
Information Patent Application
Conduited heat dissipation device
- Publication number 20020067596
- Publication date Jun 6, 2002
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Microplates, reaction modules and detection systems

Circuit board with added impedance

Semiconductor device with components embedded in backside diamond l...

Metallurgically enhanced heat sink

Surface mount connector lead

Circuit board with added impedance

Iodine-containing thermal interface material

Electrically modifiable product labeling

Fluorescence emission ratio imaging thermography for use in heat tr...

Semiconductor device with components embedded in backside diamond l...

Apparatus and method to read output information from a backside of...

Vapor chamber active heat sink

Process for local on-chip cooling of semiconductor devices using bu...

Circuit card assembly having controlled vibrational properties

Circuit card assembly having controlled expansion properties

Heat sink with integrated fluid circulation pump

Patents Applicationslast 30 patents

Microplates, Reaction Modules and Detection Systems

Circuit board with added impedance

Semiconductor device with components embedded in backside diamond l...

Electrically modifiable product labeling

SEMICONDUCTOR DEVICE WITH COMPONENTS EMBEDDED IN BACKSIDE DIAMOND L...

Fluorescence emission ratio imaging thermography for use in heat tr...

Self-powered wireless device

Iodine-containing thermal interface material

Ergonomic auxiliary screen and display subsystem for portable handh...

PROCESS FOR LOCAL ON-CHIP COOLING OF SEMICONDUCTOR DEVICES USING BU...

Heat dissipation device

Apparatus and method to read output information from a backside of...

Conduited heat dissipation device