Bin Tian

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for making semiconductor package
- Patent number 8,216,886
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Bin Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor device
- Patent number 8,115,288
- Issue date Feb 14, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yongsheng Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
QFN DEVICE AND LEAD FRAME THEREFOR
- Publication number 20130049180
- Publication date Feb 28, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Nan XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR DEVICE
- Publication number 20110248393
- Publication date Oct 13, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Yongsheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING SEMICONDUCTOR PACKAGE
- Publication number 20110193237
- Publication date Aug 11, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Bin Tian
- H01 - BASIC ELECTRIC ELEMENTS