Bin Xie

Person

New Territories, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Smart power hub
- Patent number 11,407,322
- Issue date Aug 9, 2022
- Hong Kong Applied Science & Technology Research Institute Company, Limited
- Xuechao Liu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for optimizing electrodeposition process of a plurality of v...
- Patent number 9,075,941
- Issue date Jul 7, 2015
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yaofeng Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through-silicon via structure with patterned surface, patterned sid...
- Patent number 8,791,578
- Issue date Jul 29, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Pui Chung Simon Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming through-silicon-vias for multi-wafer integrated circuits
- Patent number 8,754,507
- Issue date Jun 17, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Bin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with through-silicon-via and sidewall pad
- Patent number 8,674,482
- Issue date Mar 18, 2014
- Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Xunqing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulse-laser bonding method for through-silicon-via based stacking o...
- Patent number 8,138,577
- Issue date Mar 20, 2012
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Xunqing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate warpage-reducing structure
- Patent number 7,879,438
- Issue date Feb 1, 2011
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Jyh-Rong Lin
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Smart Power Hub
- Publication number 20210070185
- Publication date Mar 11, 2021
- Hong Kong Applied Science and Technology Research Institute Company, Limited
- Xuechao LIU
- B60 - VEHICLES IN GENERAL
Information Patent Application
Method for Optimizing Electrodeposition Process of a Plurality of V...
- Publication number 20140343901
- Publication date Nov 20, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yaofeng SUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH-SILICON VIA STRUCTURE WITH PATTERNED SURFACE, PATTERNED SID...
- Publication number 20140131882
- Publication date May 15, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Pui Chung Simon LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING THROUGH-SILICON-VIAS FOR MULTI-WAFER INTEGRATED CIRCUITS
- Publication number 20120181698
- Publication date Jul 19, 2012
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Bin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Electronic Components, Method and Apparatus for Aligning El...
- Publication number 20110235299
- Publication date Sep 29, 2011
- Chi Kuen Vincent Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WARPAGE-REDUCING STRUCTURE
- Publication number 20100247879
- Publication date Sep 30, 2010
- Hong Kong Applied Science and Technology Researh Institute Co. Ltd.
- Jyh-Rong Lin
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
HOST SUBSTRATE FOR NITRIDE BASED LIGHT EMITTING DEVICES
- Publication number 20100244195
- Publication date Sep 30, 2010
- Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Limin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH THROUGH-SILICON-VIA AND SIDEWALL PAD
- Publication number 20100123241
- Publication date May 20, 2010
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Xunqing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pulse-Laser Bonding Method for Through-Silicon-Via Based Stacking o...
- Publication number 20090243046
- Publication date Oct 1, 2009
- Xunqing Shi
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Smart power hub

Method for optimizing electrodeposition process of a plurality of v...

Through-silicon via structure with patterned surface, patterned sid...

Forming through-silicon-vias for multi-wafer integrated circuits

Semiconductor chip with through-silicon-via and sidewall pad

Pulse-laser bonding method for through-silicon-via based stacking o...

Substrate warpage-reducing structure

Patents Applicationslast 30 patents

Smart Power Hub

Method for Optimizing Electrodeposition Process of a Plurality of V...

THROUGH-SILICON VIA STRUCTURE WITH PATTERNED SURFACE, PATTERNED SID...

FORMING THROUGH-SILICON-VIAS FOR MULTI-WAFER INTEGRATED CIRCUITS

Stacked Electronic Components, Method and Apparatus for Aligning El...

SUBSTRATE WARPAGE-REDUCING STRUCTURE

HOST SUBSTRATE FOR NITRIDE BASED LIGHT EMITTING DEVICES

SEMICONDUCTOR CHIP WITH THROUGH-SILICON-VIA AND SIDEWALL PAD

Pulse-Laser Bonding Method for Through-Silicon-Via Based Stacking o...