Bing-Han CHUANG

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Xiamen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Backside metallized compound semiconductor device and method for ma...
- Patent number 11,823,891
- Issue date Nov 21, 2023
- Xiamen Sanan Integrated Circuit Co., Ltd.
- Tsung-Te Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing backside metalized compound semiconductor...
- Patent number 11,264,231
- Issue date Mar 1, 2022
- Xiamen Sanan Integrated Circuit Co., Ltd.
- Tsung-Te Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE METALLIZED COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MA...
- Publication number 20240087877
- Publication date Mar 14, 2024
- XIAMEN SANAN INTEGRATED CIRCUIT CO., LTD.
- Tsung-Te CHIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BACKSIDE METALLIZED COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MA...
- Publication number 20210134584
- Publication date May 6, 2021
- XIAMEN SANAN INTEGRATED CIRCUIT CO., LTD.
- Tsung-Te CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BACKSIDE METALIZED COMPOUND SEMICONDUCTOR...
- Publication number 20200152445
- Publication date May 14, 2020
- XIAMEN SANAN INTEGRATED CIRCUIT CO., LTD.
- Tsung-Te CHIU
- H01 - BASIC ELECTRIC ELEMENTS