Bing HU

Follow

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming engineered wafers
- Patent number 12,191,192
- Issue date Jan 7, 2025
- Bing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating the main part of a semiconductor substrate fro...
- Patent number 10,734,274
- Issue date Aug 4, 2020
- Bing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a thin crystalline semiconductor material
- Patent number 8,946,067
- Issue date Feb 3, 2015
- Bing Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SEPARATING A FILM FROM A BRITTLE MATERIAL
- Publication number 20200321242
- Publication date Oct 8, 2020
- Bing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ENGINEERED WAFERS
- Publication number 20200058542
- Publication date Feb 20, 2020
- Bing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEPARATING THE MAIN PART OF A SEMICONDUCTOR SUBSTRATE FRO...
- Publication number 20180158720
- Publication date Jun 7, 2018
- Bing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A THIN CRYSTALLINE SEMICONDUCTOR MATERIAL
- Publication number 20130330915
- Publication date Dec 12, 2013
- Bing HU
- H01 - BASIC ELECTRIC ELEMENTS