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Patents Grants
last 30 patents
Information
Patent Grant
Method for cutting substrate by laser and laser cutting device
Patent number
9,963,376
Issue date
May 8, 2018
BOE Technology Group Co., Ltd.
Dai Dong
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Patents Applications
last 30 patents
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Patent Application
METHOD FOR CUTTING SUBSTRATE BY LASER AND LASER CUTTING DEVICE
Publication number
20160362325
Publication date
Dec 15, 2016
BOE TECHNOLOGY GROUP CO., LTD.
Dai DONG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR