Binghua Pan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic power package and heat sink/cold rail arrangement
- Patent number 12,087,659
- Issue date Sep 10, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Binghua Pan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Object sensor assembly including stereoscopic cameras and range fin...
- Patent number 10,830,887
- Issue date Nov 10, 2020
- Aptiv Technologies Limited
- Yew Kwang Low
- G01 - MEASURING TESTING
Information Patent Grant
LIDAR device with heated cover useful for automated vehicles
- Patent number 10,351,103
- Issue date Jul 16, 2019
- APTIV TECHNOLOGIES LIMITED
- Kok Wee Yeo
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Ball grid array packaged camera device soldered to a substrate
- Patent number 9,231,124
- Issue date Jan 5, 2016
- Delphi Technologies, Inc.
- Binghua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube via interconnect
- Patent number 7,453,154
- Issue date Nov 18, 2008
- Delphi Technologies, Inc.
- Kiat Choon Teo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical information processing circuit assembly
- Patent number 7,324,715
- Issue date Jan 29, 2008
- Delphi Technologies, Inc.
- Tecktiong Tan
- G02 - OPTICS
Information Patent Grant
Electronic module with light-blocking features
- Patent number 7,294,827
- Issue date Nov 13, 2007
- Delphi Technologies, Inc.
- Teck Tiong Tan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Discrete electronic component arrangement including anchoring, ther...
- Patent number 7,148,554
- Issue date Dec 12, 2006
- Delphi Technologies, Inc.
- Chih Kai Nah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC POWER PACKAGE AND HEAT SINK/COLD RAIL ARRANGEMENT
- Publication number 20220068753
- Publication date Mar 3, 2022
- DELPHI TECHNOLOGIES IP LIMITED
- Binghua PAN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
OBJECT SENSOR ASSEMBLY INCLUDING STEREOSCOPIC CAMERAS AND RANGE FIN...
- Publication number 20190227168
- Publication date Jul 25, 2019
- Delphi Technologies, LLC
- Yew Kwang Low
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LIDAR DEVICE WITH HEATED COVER USEFUL FOR AUTOMATED VEHICLES
- Publication number 20190100167
- Publication date Apr 4, 2019
- Delphi Technologies, Inc.
- Kok Wee Yeo
- B60 - VEHICLES IN GENERAL
Information Patent Application
MOLDED CAMERA
- Publication number 20160006908
- Publication date Jan 7, 2016
- Delphi Technologies, Inc.
- BINGHUA PAN
- B60 - VEHICLES IN GENERAL
Information Patent Application
BALL GRID ARRAY PACKAGED CAMERA DEVICE SOLDERED TO A SUBSTRATE
- Publication number 20150084150
- Publication date Mar 26, 2015
- BINGHUA PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPLINE TO WAVEGUIDE PERPENDICULAR TRANSITION
- Publication number 20110037530
- Publication date Feb 17, 2011
- Delphi Technologies, Inc.
- Sankara N. Mangalahgari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon nanotube via interconnect
- Publication number 20070228926
- Publication date Oct 4, 2007
- Kiat Choon Teo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of forming a composite standoff on a circuit board
- Publication number 20070119911
- Publication date May 31, 2007
- Su Liang Chan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DISCRETE ELECTRONIC COMPONENT ARRANGEMENT INCLUDING ANCHORING, THER...
- Publication number 20060131732
- Publication date Jun 22, 2006
- Chih Kai Nah
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC MODULE WITH LIGHT-BLOCKING FEATURES
- Publication number 20060061889
- Publication date Mar 23, 2006
- DELPHI TECHNOLOGIES, INC
- Tech Tiong Tan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical information processing circuit assembly
- Publication number 20040114851
- Publication date Jun 17, 2004
- Tecktiong Tan
- G02 - OPTICS

Binghua Pan

Person

Patents Grantslast 30 patents

Electronic power package and heat sink/cold rail arrangement

Object sensor assembly including stereoscopic cameras and range fin...

LIDAR device with heated cover useful for automated vehicles

Ball grid array packaged camera device soldered to a substrate

Carbon nanotube via interconnect

Optical information processing circuit assembly

Electronic module with light-blocking features

Discrete electronic component arrangement including anchoring, ther...

Patents Applicationslast 30 patents

ELECTRONIC POWER PACKAGE AND HEAT SINK/COLD RAIL ARRANGEMENT

OBJECT SENSOR ASSEMBLY INCLUDING STEREOSCOPIC CAMERAS AND RANGE FIN...

LIDAR DEVICE WITH HEATED COVER USEFUL FOR AUTOMATED VEHICLES

MOLDED CAMERA

BALL GRID ARRAY PACKAGED CAMERA DEVICE SOLDERED TO A SUBSTRATE

STRIPLINE TO WAVEGUIDE PERPENDICULAR TRANSITION

Carbon nanotube via interconnect

Method of forming a composite standoff on a circuit board

DISCRETE ELECTRONIC COMPONENT ARRANGEMENT INCLUDING ANCHORING, THER...

ELECTRONIC MODULE WITH LIGHT-BLOCKING FEATURES

Optical information processing circuit assembly