Binglin Miao

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Loudonville, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding using boron and nitrogen based bonding stack
- Patent number 9,640,514
- Issue date May 2, 2017
- GLOBALFOUNDRIES Inc.
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON RESIDUE REMOVAL IN NANOSHEET TRANSISTORS
- Publication number 20190096669
- Publication date Mar 28, 2019
- International Business Machines Corporation
- Zhenxing Bi
- H01 - BASIC ELECTRIC ELEMENTS