Bingsen XIE

Person

Guangdong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation-electromagnetic shielding embedded packaging struc...
- Patent number 12,074,115
- Issue date Aug 27, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded structure, manufacturing method thereof and substrate
- Patent number 11,942,465
- Issue date Mar 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing coreless substrate
- Patent number 11,399,440
- Issue date Jul 26, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure of integrated passive device and manufacturing me...
- Patent number 11,342,273
- Issue date May 24, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer board without feature layer structure and method for man...
- Patent number 11,257,713
- Issue date Feb 22, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION-ELECTROMAGNETIC SHIELDING EMBEDDED PACKAGING STRUC...
- Publication number 20220310529
- Publication date Sep 29, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...
- Publication number 20220295646
- Publication date Sep 15, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED STRUCTURE, MANUFACTURING METHOD THEREOF AND SUBSTRATE
- Publication number 20220059520
- Publication date Feb 24, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220045043
- Publication date Feb 10, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...
- Publication number 20210410297
- Publication date Dec 30, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE OF INTEGRATED PASSIVE DEVICE AND MANUFACTURING ME...
- Publication number 20210407922
- Publication date Dec 30, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER BOARD WITHOUT FEATURE LAYER STRUCTURE AND METHOD FOR MAN...
- Publication number 20210391213
- Publication date Dec 16, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Bingsen XIE

Person

Patents Grantslast 30 patents

Heat dissipation-electromagnetic shielding embedded packaging struc...

Embedded structure, manufacturing method thereof and substrate

Method for manufacturing coreless substrate

Package structure of integrated passive device and manufacturing me...

Interposer board without feature layer structure and method for man...

Patents Applicationslast 30 patents

HEAT DISSIPATION-ELECTROMAGNETIC SHIELDING EMBEDDED PACKAGING STRUC...

TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...

EMBEDDED STRUCTURE, MANUFACTURING METHOD THEREOF AND SUBSTRATE

EMBEDDED PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...

PACKAGE STRUCTURE OF INTEGRATED PASSIVE DEVICE AND MANUFACTURING ME...

INTERPOSER BOARD WITHOUT FEATURE LAYER STRUCTURE AND METHOD FOR MAN...