Bingxi Sun

Person

Stanford, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated deposition process for copper metallization
- Patent number 6,881,673
- Issue date Apr 19, 2005
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated deposition process for copper metallization
- Patent number 6,566,259
- Issue date May 20, 2003
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stress tunable tantalum and tantalum nitride films
- Patent number 6,488,823
- Issue date Dec 3, 2002
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper alloy seed layer for copper metallization
- Patent number 6,387,805
- Issue date May 14, 2002
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode...
- Patent number 6,313,033
- Issue date Nov 6, 2001
- Applied Materials, Inc.
- Tony Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating of vacuum chambers to reduce pump down time and base pressure
- Patent number 6,217,715
- Issue date Apr 17, 2001
- Applied Materials, Inc.
- Bingxi Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated deposition process for copper metallization
- Patent number 6,174,811
- Issue date Jan 16, 2001
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper alloy via structure
- Patent number 6,160,315
- Issue date Dec 12, 2000
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper alloy seed layer for copper metallization in an integrated c...
- Patent number 6,066,892
- Issue date May 23, 2000
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputter deposition and annealing of copper alloy metallization
- Patent number 6,037,257
- Issue date Mar 14, 2000
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of cleaning a surface of a material layer
- Publication number 20040168705
- Publication date Sep 2, 2004
- APPLIED MATERIALS, INC.
- Bingxi Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of cleaning a surface of a material layer
- Publication number 20040018715
- Publication date Jan 29, 2004
- APPLIED MATERIALS, INC.
- Bingxi Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated deposition process for copper metallization
- Publication number 20030194863
- Publication date Oct 16, 2003
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Integrated deposition process for copper metallization

Integrated deposition process for copper metallization

Stress tunable tantalum and tantalum nitride films

Copper alloy seed layer for copper metallization

Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode...

Coating of vacuum chambers to reduce pump down time and base pressure

Integrated deposition process for copper metallization

Copper alloy via structure

Copper alloy seed layer for copper metallization in an integrated c...

Sputter deposition and annealing of copper alloy metallization

Patents Applicationslast 30 patents

Method of cleaning a surface of a material layer

Method of cleaning a surface of a material layer

Integrated deposition process for copper metallization