Bingzhi Su

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Filled through silicon vias for semiconductor packages and related...
- Patent number 11,075,306
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and related methods
- Patent number 10,770,492
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and related methods
- Patent number 10,079,254
- Issue date Sep 18, 2018
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and related methods
- Patent number 9,754,983
- Issue date Sep 5, 2017
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILLED THROUGH SILICON VIAS FOR SEMICONDUCTOR PACKAGES AND RELATED...
- Publication number 20190115482
- Publication date Apr 18, 2019
- Semiconductor Components Industries, LLC
- Bingzhi SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND RELATED METHODS
- Publication number 20180342549
- Publication date Nov 29, 2018
- Semiconductor Components Industries, LLC
- Bingzhi SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND RELATED METHODS
- Publication number 20180019275
- Publication date Jan 18, 2018
- Semiconductor Components Industries, LLC
- Bingzhi SU
- H01 - BASIC ELECTRIC ELEMENTS