Binneg Y. LAO

Person

Rancho Palos Verdes, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip assembly with frequency extending device
- Patent number 8,525,313
- Issue date Sep 3, 2013
- Semtech Corporation
- Binneg Y. Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for a chip assembly including a frequency exte...
- Patent number 8,159,052
- Issue date Apr 17, 2012
- Semtech Corporation
- Binneg Y. Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single and multiple layer packaging of high-speed/high-density ICs
- Patent number 6,803,252
- Issue date Oct 12, 2004
- Sierra Monolithics, Inc.
- Binneg Y. Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-wideband power amplifier module apparatus and method for opti...
- Patent number 6,639,461
- Issue date Oct 28, 2003
- Sierra Monolithics, Inc.
- Alan K. Tam
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multi-gigabit-per-sec clock recovery apparatus and method for optic...
- Patent number 6,509,801
- Issue date Jan 21, 2003
- Sierra Monolithics, Inc.
- Binneg Y. Lao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Superconducting gyroscope
- Patent number 5,406,847
- Issue date Apr 18, 1995
- Sierra Monolithics, Inc.
- David A. Rowe
- G01 - MEASURING TESTING
Information Patent Grant
Microwave multiport multilayered integrated circuit chip carrier
- Patent number 4,739,448
- Issue date Apr 19, 1988
- Magnavox Government and Industrial Electronics Company
- David A. Rowe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplanar and stripline probe card apparatus
- Patent number 4,593,243
- Issue date Jun 3, 1986
- Magnavox Government and Industrial Electronics Company
- Binneg Y. Lao
- G01 - MEASURING TESTING
Information Patent Grant
Surface acoustic wave infrared line imaging array
- Patent number 4,584,475
- Issue date Apr 22, 1986
- Allied Corporation
- Binneg Y. Lao
- G01 - MEASURING TESTING
Information Patent Grant
Pressure compensated circuit for ion mass airflow sensors
- Patent number 4,387,602
- Issue date Jun 14, 1983
- The Bendix Corporation
- Binneg Y. Lao
- G01 - MEASURING TESTING
Information Patent Grant
Surface acoustic wave gyroscope
- Patent number 4,384,409
- Issue date May 24, 1983
- The Bendix Corporation
- Binneg Y. Lao
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CHIP ASSEMBLY WITH FREQUENCY EXTENDING DEVICE
- Publication number 20120168928
- Publication date Jul 5, 2012
- SEMTECH CORPORATION
- Binneg Y. LAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR A CHIP ASSEMBLY INCLUDING A FREQUENCY EXTE...
- Publication number 20090256266
- Publication date Oct 15, 2009
- Sierra Monolithics, Inc.
- Binneg Y. LAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection package for high-speed integrated circuit
- Publication number 20030095014
- Publication date May 22, 2003
- Binneg Y. Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single and multiple layer packaging of high-speed/high-density ICs
- Publication number 20030096447
- Publication date May 22, 2003
- Binneg Y. Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GIGABIT-PER-SEC CLOCK RECOVERY APPARATUS AND METHOD FOR OPTIC...
- Publication number 20030001640
- Publication date Jan 2, 2003
- Binneg Y. Lao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Binneg Y. LAO

Person

Patents Grantslast 30 patents

Chip assembly with frequency extending device

Apparatus and method for a chip assembly including a frequency exte...

Single and multiple layer packaging of high-speed/high-density ICs

Ultra-wideband power amplifier module apparatus and method for opti...

Multi-gigabit-per-sec clock recovery apparatus and method for optic...

Superconducting gyroscope

Microwave multiport multilayered integrated circuit chip carrier

Coplanar and stripline probe card apparatus

Surface acoustic wave infrared line imaging array

Pressure compensated circuit for ion mass airflow sensors

Surface acoustic wave gyroscope

Patents Applicationslast 30 patents

CHIP ASSEMBLY WITH FREQUENCY EXTENDING DEVICE

APPARATUS AND METHOD FOR A CHIP ASSEMBLY INCLUDING A FREQUENCY EXTE...

Connection package for high-speed integrated circuit

Single and multiple layer packaging of high-speed/high-density ICs

MULTI-GIGABIT-PER-SEC CLOCK RECOVERY APPARATUS AND METHOD FOR OPTIC...