Bisweswar Patnaik

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Wappingers Falls, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Forming interconnections for multilevel interconnection metallurgy...
- Patent number 4,410,622
- Issue date Oct 18, 1983
- International Business Machines Corporation
- Hormazdyzr D. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming self-aligned via holes in thin film interconnection systems
- Patent number 4,070,501
- Issue date Jan 24, 1978
- IBM Corporation
- Vivian Ruth Corbin
- H01 - BASIC ELECTRIC ELEMENTS