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Blake F. Woith
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Santa Ana, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Electrical connector having improved elastomeric contact pressure pad
Patent number
6,869,291
Issue date
Mar 22, 2005
Delphi Technologies, Inc.
Raymond Jose Norland
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
De-mountable, solderless in-line lead module package with interface
Patent number
6,614,659
Issue date
Sep 2, 2003
Delphi Technologies, Inc.
Haim Feigenbaum
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bump contact force concentration system and method
Patent number
6,595,785
Issue date
Jul 22, 2003
Delphi Technologies, Inc.
Eric D. Jensen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connector assembly for flexible circuits
Patent number
6,533,588
Issue date
Mar 18, 2003
Delphi Technologies, Inc.
Blake F. Woith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device for testing integrated circuit chips during vibration
Patent number
5,777,484
Issue date
Jul 7, 1998
Packard Hughes Interconnect Company
Blake F. Woith
G01 - MEASURING TESTING
Information
Patent Grant
Sliding wedge electrical connector
Patent number
5,224,865
Issue date
Jul 6, 1993
Hughes Aircraft Company
Blake F. Woith
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Electrical connector having improved elastomeric contact pressure pad
Publication number
20040058565
Publication date
Mar 25, 2004
Raymond Jose Norland
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DE-MOUNTABLE, SOLDERLESS IN-LINE LEAD MODULE PACKAGE WITH INTERFACE
Publication number
20030107874
Publication date
Jun 12, 2003
Haim Feigenbaum
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bump contact force concentration system and method
Publication number
20030068905
Publication date
Apr 10, 2003
Eric D. Jensen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR