Bénédite Osternaud

Person

St Laurent du Pont, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Recycling by mechanical means of a wafer comprising a multilayer st...
- Patent number 7,602,046
- Issue date Oct 13, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recycling a wafer comprising a buffer layer, after having separated...
- Patent number 7,378,729
- Issue date May 27, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recycling by mechanical means of a wafer comprising a multilayer st...
- Patent number 7,375,008
- Issue date May 20, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recycling of a wafer comprising a multi-layer structure after takin...
- Patent number 7,256,075
- Issue date Aug 14, 2007
- S.O.I. Tec Silicon on Insulator Technologies
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recycling of a wafer comprising a buffer layer after having separat...
- Patent number 7,033,905
- Issue date Apr 25, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer of a thin layer from a wafer comprising a buffer layer
- Patent number 7,018,910
- Issue date Mar 28, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recycling a wafer comprising a buffer layer, after having separated...
- Patent number 7,008,857
- Issue date Mar 7, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for transferring a thin layer from a wafer having a buffer...
- Patent number 6,991,956
- Issue date Jan 31, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for adjusting the thickness of a thin layer of...
- Patent number 6,908,774
- Issue date Jun 21, 2005
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF RECYCLING AN EPITAXIED DONOR WAFER
- Publication number 20100167500
- Publication date Jul 1, 2010
- S.O.TEC SILICON ON INSULATOR TECHNOLOGIES
- Nabil Chhaimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recycling a wafer comprising a buffer layer, after having separated...
- Publication number 20060076578
- Publication date Apr 13, 2006
- S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for transferring a thin layer from a wafer having a buffer...
- Publication number 20050191825
- Publication date Sep 1, 2005
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recycling by mechanical means of a wafer comprising a multilayer st...
- Publication number 20050189323
- Publication date Sep 1, 2005
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recycling of a wafer comprising a multi-layer structure after takin...
- Publication number 20050170611
- Publication date Aug 4, 2005
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recycling of a wafer comprising a multi-layer structure after takin...
- Publication number 20050167002
- Publication date Aug 4, 2005
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recycling by mechanical means of a wafer comprising a multilayer st...
- Publication number 20050150447
- Publication date Jul 14, 2005
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer of a thin layer from a wafer comprising a buffer layer
- Publication number 20040157409
- Publication date Aug 12, 2004
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for adjusting the thickness of a thin layer of...
- Publication number 20040152311
- Publication date Aug 5, 2004
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recycling a wafer comprising a buffer layer, after having separated...
- Publication number 20040152284
- Publication date Aug 5, 2004
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recycling of a wafer comprising a buffer layer after having separat...
- Publication number 20040110378
- Publication date Jun 10, 2004
- Bruno Ghyselen
- C30 - CRYSTAL GROWTH
Information Patent Application
Method and apparatus for adjusting the thickness of a layer of semi...
- Publication number 20040087042
- Publication date May 6, 2004
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS

Bénédite Osternaud

Person

Patents Grantslast 30 patents

Recycling by mechanical means of a wafer comprising a multilayer st...

Recycling a wafer comprising a buffer layer, after having separated...

Recycling by mechanical means of a wafer comprising a multilayer st...

Recycling of a wafer comprising a multi-layer structure after takin...

Recycling of a wafer comprising a buffer layer after having separat...

Transfer of a thin layer from a wafer comprising a buffer layer

Recycling a wafer comprising a buffer layer, after having separated...

Methods for transferring a thin layer from a wafer having a buffer...

Method and apparatus for adjusting the thickness of a thin layer of...

Patents Applicationslast 30 patents

METHOD OF RECYCLING AN EPITAXIED DONOR WAFER

Recycling a wafer comprising a buffer layer, after having separated...

Methods for transferring a thin layer from a wafer having a buffer...

Recycling by mechanical means of a wafer comprising a multilayer st...

Recycling of a wafer comprising a multi-layer structure after takin...

Recycling of a wafer comprising a multi-layer structure after takin...

Recycling by mechanical means of a wafer comprising a multilayer st...

Transfer of a thin layer from a wafer comprising a buffer layer

Method and apparatus for adjusting the thickness of a thin layer of...

Recycling a wafer comprising a buffer layer, after having separated...

Recycling of a wafer comprising a buffer layer after having separat...

Method and apparatus for adjusting the thickness of a layer of semi...