Bo Chang

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor packages
- Patent number 12,190,626
- Issue date Jan 7, 2025
- Cypress Semiconductor Corporation
- Oleksandr Hoshtanar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packaging identifier
- Patent number 9,263,398
- Issue date Feb 16, 2016
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging identifier
- Patent number 8,999,752
- Issue date Apr 7, 2015
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die paddle leadframe and semiconductor device package
- Patent number 8,436,460
- Issue date May 7, 2013
- Cypress Semiconductor Corporation
- Carlo Gamboa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with electrically isolated leads
- Patent number 8,318,547
- Issue date Nov 27, 2012
- Cypress Semiconductor Corporation
- Brett Alan Spurlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-compensating die paddle design for high thermal-mismatched...
- Patent number 8,017,445
- Issue date Sep 13, 2011
- Cypress Semiconductor Corporation
- Bo Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging using etched leadfingers
- Patent number 7,939,372
- Issue date May 10, 2011
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-flop semiconductor device packaging using an interposer
- Patent number 7,939,371
- Issue date May 10, 2011
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for controlling the processing of an integrated circuit chip...
- Patent number 7,818,085
- Issue date Oct 19, 2010
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated back-end integrated circuit manufacturing assembly
- Patent number 7,698,015
- Issue date Apr 13, 2010
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with electrically isolated leads
- Patent number 7,608,914
- Issue date Oct 27, 2009
- Cypress Semiconductor Corporation
- Brett Alan Spurlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-stick detection method and mechanism for array molded laminate...
- Patent number 7,391,104
- Issue date Jun 24, 2008
- Cypress Semiconductor Corporation
- Bo Chang
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for universal packaging in conjunction with a bac...
- Patent number 7,105,377
- Issue date Sep 12, 2006
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing back-end manufacturing of an integrated circui...
- Patent number 7,045,387
- Issue date May 16, 2006
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for a reject management protocol within a back-en...
- Patent number 7,031,791
- Issue date Apr 18, 2006
- Cypress Semiconductor Corp.
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated back-end integrated circuit manufacturing assembly
- Patent number 6,931,298
- Issue date Aug 16, 2005
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for controlling the processing of an integrated c...
- Patent number 6,901,984
- Issue date Jun 7, 2005
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-stick detection method and mechanism for array molded laminate...
- Patent number 6,853,202
- Issue date Feb 8, 2005
- Cypress Semiconductor Corporation
- Bo Chang
- G01 - MEASURING TESTING
Information Patent Grant
Method of performing back-end manufacturing of an integrated circui...
- Patent number 6,730,545
- Issue date May 4, 2004
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for universal packaging in conjunction with a bac...
- Patent number 6,730,532
- Issue date May 4, 2004
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for plastic injection molding, with particular applicabilit...
- Patent number 6,649,447
- Issue date Nov 18, 2003
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing high reliability lead frame and packaging sem...
- Patent number 6,576,491
- Issue date Jun 10, 2003
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for delamination-resistant, array type molding...
- Patent number 6,562,272
- Issue date May 13, 2003
- Cypress Semiconductor Corporation
- Bo Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High reliability lead frame and packaging technology containing the...
- Patent number 6,331,728
- Issue date Dec 18, 2001
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density lead frames and methods for plastic injection molding
- Patent number 6,316,821
- Issue date Nov 13, 2001
- Cypress Semiconductor Corporation
- Bo Soon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture, circuitry and method for configuring volatile and/or...
- Patent number 6,215,689
- Issue date Apr 10, 2001
- Cypress Semiconductor Corporation
- Khushrav S. Chhor
- G11 - INFORMATION STORAGE
Information Patent Grant
Die attach pad adapted to reduce delamination stress and method of...
- Patent number 6,169,322
- Issue date Jan 2, 2001
- Cypress Semiconductor Corporation
- Bo S. Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINGERPRINT SENSOR PACKAGES
- Publication number 20240304023
- Publication date Sep 12, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Oleksandr HOSHTANAR
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Fingerprint sensor packages

Semiconductor packaging identifier

Semiconductor packaging identifier

Multiple die paddle leadframe and semiconductor device package

Integrated circuit package with electrically isolated leads

Warpage-compensating die paddle design for high thermal-mismatched...

Semiconductor device packaging using etched leadfingers

Flip-flop semiconductor device packaging using an interposer

System for controlling the processing of an integrated circuit chip...

Integrated back-end integrated circuit manufacturing assembly

Integrated circuit package with electrically isolated leads

Non-stick detection method and mechanism for array molded laminate...

Method and system for universal packaging in conjunction with a bac...

Method of performing back-end manufacturing of an integrated circui...

Method and system for a reject management protocol within a back-en...

Integrated back-end integrated circuit manufacturing assembly

Method and system for controlling the processing of an integrated c...

Non-stick detection method and mechanism for array molded laminate...

Method of performing back-end manufacturing of an integrated circui...

Method and system for universal packaging in conjunction with a bac...

Methods for plastic injection molding, with particular applicabilit...

Methods for producing high reliability lead frame and packaging sem...

Apparatus and method for delamination-resistant, array type molding...

High reliability lead frame and packaging technology containing the...

High density lead frames and methods for plastic injection molding

Architecture, circuitry and method for configuring volatile and/or...

Die attach pad adapted to reduce delamination stress and method of...

Patents Applicationslast 30 patents

FINGERPRINT SENSOR PACKAGES