Bo-Cheng Lin

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Pingtung County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method of forming hole thereof
- Patent number 11,523,503
- Issue date Dec 6, 2022
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrate structure and manufacturing method thereof
- Patent number 10,863,618
- Issue date Dec 8, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD OF FORMING HOLE THEREOF
- Publication number 20220061157
- Publication date Feb 24, 2022
- Unimicron Technology Corp.
- Kai-Ming YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200196440
- Publication date Jun 18, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS