Bo Fu

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Shanghai, CN

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Patents Applicationslast 30 patents

Information Patent Application
Method of Thinning a Semiconductor Die
- Publication number 20230326906
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Meiqin Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Protective Layer
- Publication number 20230260949
- Publication date Aug 17, 2023
- Western Digital Technologies, Inc.
- Joyce Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR CELL BACKSHEET WITH IMPROVED ADHESION TO ENCAPSULANT
- Publication number 20140048125
- Publication date Feb 20, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- Bo Fu
- B32 - LAYERED PRODUCTS