Bo-Hsiang Tseng

Follow

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode substrate and light emitting diode
- Patent number 8,624,279
- Issue date Jan 7, 2014
- Sino-American Silicon Products Inc.
- Bo-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package Substrate Structure
- Publication number 20130118794
- Publication date May 16, 2013
- Bo-Yu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Forming Package Substrate With Ultra-Thin Seed Layer
- Publication number 20130072012
- Publication date Mar 21, 2013
- Bo-Yu Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE SUBSTRATE AND LIGHT EMITTING DIODE
- Publication number 20120305965
- Publication date Dec 6, 2012
- SINO-AMERICAN SILICON PRODUCTS INC.
- Bo-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED SUBSTRATE AND LED
- Publication number 20120292630
- Publication date Nov 22, 2012
- Sino American Silicon Products Inc.
- Yew-Chung Sermon Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Fabricating Circuit Trace On Core Board Having Buried Hole
- Publication number 20090308527
- Publication date Dec 17, 2009
- Chien-Wei Chang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...