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Bo-in Noh

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  • Suwon-si, KR
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250239552
    • Publication date Jul 24, 2025
    • Samsung Electronics Co., Ltd.
    • Yong Ho KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230317539
    • Publication date Oct 5, 2023
    • Samsung Electronics Co., Ltd.
    • Bo In NOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230034654
    • Publication date Feb 2, 2023
    • Samsung Electronics Co., Ltd.
    • Yong Ho KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20190304941
    • Publication date Oct 3, 2019
    • Samsung Electronics Co., Ltd.
    • Jung-woo KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMP STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE BUMP STRUCTURE,...
    • Publication number 20190096836
    • Publication date Mar 28, 2019
    • Samsung Electronics Co., Ltd.
    • BO-IN NOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICES
    • Publication number 20190027453
    • Publication date Jan 24, 2019
    • Samsung Electronics Co., Ltd.
    • YONG HO KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20180090459
    • Publication date Mar 29, 2018
    • Samsung Electronics Co., Ltd.
    • Jung-woo KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20150366050
    • Publication date Dec 17, 2015
    • Samsung Electronics Co., Ltd.
    • Bo-in Noh
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR