Bo-in Noh

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Metal pillar in a film-type seconductor package
- Patent number 10,867,948
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pillar in a film-type semiconductor package
- Patent number 10,354,967
- Issue date Jul 16, 2019
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230317539
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Bo In NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190304941
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Jung-woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE BUMP STRUCTURE,...
- Publication number 20190096836
- Publication date Mar 28, 2019
- Samsung Electronics Co., Ltd.
- BO-IN NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190027453
- Publication date Jan 24, 2019
- Samsung Electronics Co., Ltd.
- YONG HO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180090459
- Publication date Mar 29, 2018
- Samsung Electronics Co., Ltd.
- Jung-woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150366050
- Publication date Dec 17, 2015
- Samsung Electronics Co., Ltd.
- Bo-in Noh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Metal pillar in a film-type seconductor package

Metal pillar in a film-type semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

BUMP STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE BUMP STRUCTURE,...

SEMICONDUCTOR DEVICES

FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE