Bo Mi Kim

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Chungcheongnam-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing light-emitting diode package
- Patent number 10,211,377
- Issue date Feb 19, 2019
- Corning Precision Materials Co., Ltd.
- Yoon Seuk Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HERMETIC SEALING METHOD AND HERMETIC-SEALED SUBSTRATE PACKAGE
- Publication number 20170197867
- Publication date Jul 13, 2017
- Corning Precision Materials Co., Ltd.
- Choon Bong Yang
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE PACKAGE
- Publication number 20170077363
- Publication date Mar 16, 2017
- Corning Precision Materials Co., Ltd.
- Yoon Seuk Oh
- H01 - BASIC ELECTRIC ELEMENTS