Bo Mook CHUNG

Person

Incheon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier foil-attached metal foil, method of manufacturing the same,...
- Patent number 12,139,811
- Issue date Nov 12, 2024
- YMT CO., LTD.
- Hyun Woo Jeon
- B32 - LAYERED PRODUCTS
Information Patent Grant
Plated laminate and printed circuit board
- Patent number 11,499,233
- Issue date Nov 15, 2022
- YMT CO., LTD.
- Sung Wook Chun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...
- Publication number 20240260200
- Publication date Aug 1, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240237229
- Publication date Jul 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEVELING AGENT AND ELECTROPLATING COMPOSITION FOR FORMING CIRCUIT P...
- Publication number 20240174812
- Publication date May 30, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELER AND ELECTROPLATING COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240140905
- Publication date May 2, 2024
- YMT CO., LTD.
- Dea Geun KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240133039
- Publication date Apr 25, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240132441
- Publication date Apr 25, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240138075
- Publication date Apr 25, 2024
- YMT CO>< LTD.
- Sung Wook CHUN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...
- Publication number 20240015885
- Publication date Jan 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MODIFIER FOR ELECTROLYTIC NICKEL PLATING AND NICKEL ELECTRO...
- Publication number 20230203693
- Publication date Jun 29, 2023
- YMT CO., LTD.
- Sung Wook CHUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CARRIER FOIL-ATTACHED METAL FOIL, METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230020180
- Publication date Jan 19, 2023
- YMT CO.,LTD.
- Hyun Woo JEON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATED LAMINATE AND PRINTED CIRCUIT BOARD
- Publication number 20210017650
- Publication date Jan 21, 2021
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Bo Mook CHUNG

Person

Patents Grantslast 30 patents

Carrier foil-attached metal foil, method of manufacturing the same,...

Plated laminate and printed circuit board

Patents Applicationslast 30 patents

METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

LEVELING AGENT AND ELECTROPLATING COMPOSITION FOR FORMING CIRCUIT P...

LEVELER AND ELECTROPLATING COMPOSITION FOR FILLING VIA HOLE

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...

SURFACE MODIFIER FOR ELECTROLYTIC NICKEL PLATING AND NICKEL ELECTRO...

CARRIER FOIL-ATTACHED METAL FOIL, METHOD OF MANUFACTURING THE SAME,...

PLATED LAMINATE AND PRINTED CIRCUIT BOARD