Bo PU

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,257,741
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Bo Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages
- Patent number 11,205,614
- Issue date Dec 21, 2021
- Samsung Electronics Co., Ltd.
- Jun So Pak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of modeling high speed channel in semiconductor package, met...
- Patent number 11,080,460
- Issue date Aug 3, 2021
- Samsung Electronics Co., Ltd.
- Bo Pu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MODELING HIGH SPEED CHANNEL IN SEMICONDUCTOR PACKAGE, MET...
- Publication number 20210110096
- Publication date Apr 15, 2021
- Samsung Electronics Co., Ltd.
- Bo Pu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACK PACKAGES
- Publication number 20210028100
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- Junso PAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200381347
- Publication date Dec 3, 2020
- Samsung Electronics Co., Ltd.
- Bo PU
- H01 - BASIC ELECTRIC ELEMENTS