Bo Qi

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Molecular layer deposition of amorphous carbon films
- Patent number 11,859,278
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-k boron carbonitride films
- Patent number 11,830,729
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barriers for germanium
- Patent number 11,791,155
- Issue date Oct 17, 2023
- Applied Materials, Inc.
- Huiyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect free germanium oxide gap fill
- Patent number 11,781,218
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hydrogen free silicon dioxide
- Patent number 11,732,352
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Zeqing Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Non-conformal high selectivity film for etch critical dimension con...
- Patent number 11,702,751
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Bo Qi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalytic thermal deposition of carbon-containing materials
- Patent number 11,682,554
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping semiconductor films
- Patent number 11,676,813
- Issue date Jun 13, 2023
- Applied Materials, Inc.
- Aykut Aydin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
HDP sacrificial carbon gapfill
- Patent number 11,655,537
- Issue date May 23, 2023
- Applied Materials, Inc.
- Zeqing Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal silicon oxide film deposition
- Patent number 11,658,026
- Issue date May 23, 2023
- Applied Materials, Inc.
- Zeqing Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalytic formation of boron and carbon films
- Patent number 11,626,278
- Issue date Apr 11, 2023
- Applied Materials, Inc.
- Bo Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molecular layer deposition method and system
- Patent number 11,545,354
- Issue date Jan 3, 2023
- Applied Materials, Inc.
- Bhaskar Bhuyan
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
3D NAND etch
- Patent number 11,515,170
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Shishi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of low-stress boron-containing layers
- Patent number 11,495,454
- Issue date Nov 8, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of low-stress carbon-containing layers
- Patent number 11,404,263
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal deposition of doped silicon oxide
- Patent number 11,355,354
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming high boron-content hard mask materials
- Patent number 11,276,573
- Issue date Mar 15, 2022
- Applied Materials, Inc.
- Bo Qi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3D NAND etch
- Patent number 10,886,140
- Issue date Jan 5, 2021
- Applied Materials, Inc.
- Shishi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput HDP-CVD processes for advanced gapfill applications
- Patent number 8,414,747
- Issue date Apr 9, 2013
- Applied Materials, Inc.
- Bo Qi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
DEFECT FREE GERMANIUM OXIDE GAP FILL
- Publication number 20230407468
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSES FOR DEPOSITING SIB FILMS
- Publication number 20220406594
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Aykut AYDIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES TO DEPOSIT AMORPHOUS-SILICON ETCH PROTECTION LINER
- Publication number 20220351982
- Publication date Nov 3, 2022
- Applied Materials, Inc.
- Zeqing SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATALYTIC THERMAL DEPOSITION OF CARBON-CONTAINING MATERIALS
- Publication number 20220336212
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF LOW-STRESS CARBON-CONTAINING LAYERS
- Publication number 20220319841
- Publication date Oct 6, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-K BORON CARBONITRIDE FILMS
- Publication number 20220223409
- Publication date Jul 14, 2022
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER-CONFORMAL GERMANIUM OXIDE FILMS
- Publication number 20220186365
- Publication date Jun 16, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEFECT FREE GERMANIUM OXIDE GAP FILL
- Publication number 20220189824
- Publication date Jun 16, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HDP SACRIFICIAL CARBON GAPFILL
- Publication number 20220127718
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- Zeqing Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMAL SILICON OXIDE FILM DEPOSITION
- Publication number 20220130658
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- Zeqing Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DOPING SEMICONDUCTOR FILMS
- Publication number 20220093390
- Publication date Mar 24, 2022
- Applied Materials, Inc.
- Aykut Aydin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIFFUSION BARRIERS FOR GERMANIUM
- Publication number 20220068640
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF LOW-STRESS CARBON-CONTAINING LAYERS
- Publication number 20220044926
- Publication date Feb 10, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF LOW-STRESS BORON-CONTAINING LAYERS
- Publication number 20220044927
- Publication date Feb 10, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLECULAR LAYER DEPOSITION METHOD AND SYSTEM
- Publication number 20220028686
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Bhaskar Bhuyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK FOR 3D-NAND MEMORY CELL
- Publication number 20210327891
- Publication date Oct 21, 2021
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATALYTIC FORMATION OF BORON AND CARBON FILMS
- Publication number 20210305041
- Publication date Sep 30, 2021
- Applied Materials, Inc.
- Bo Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molecular Layer Deposition of Amorphous Carbon Films
- Publication number 20210277516
- Publication date Sep 9, 2021
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Hydrogen Free Silicon Dioxide
- Publication number 20210254210
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Zeqing Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH BORON-CONTENT HARD MASK MATERIALS
- Publication number 20210175078
- Publication date Jun 10, 2021
- Applied Materials, Inc.
- Bo Qi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
3D NAND Etch
- Publication number 20210118691
- Publication date Apr 22, 2021
- Applied Materials, Inc.
- Shishi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Conformal High Selectivity Film For Etch Critical Dimension Con...
- Publication number 20210047733
- Publication date Feb 18, 2021
- Applied Materials, Inc.
- Bo Qi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING SILICON NITRIDE ENCAPSULATION LAYERS
- Publication number 20200381623
- Publication date Dec 3, 2020
- Applied Materials, Inc.
- Bo QI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
3D NAND Etch
- Publication number 20200035505
- Publication date Jan 30, 2020
- Applied Materials, Inc.
- Shishi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Temperature Atomic Layer Deposition Of Silicon Nitride
- Publication number 20190330736
- Publication date Oct 31, 2019
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-THROUGHPUT HDP-CVD PROCESSES FOR ADVANCED GAPFILL APPLICATIONS
- Publication number 20080063813
- Publication date Mar 13, 2008
- Applied Materials, Inc.
- Bo Qi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High-throughput HDP-CVD processes for advanced gapfill applications
- Publication number 20060154494
- Publication date Jul 13, 2006
- APPLIED MATERIALS, INC., A Delaware corporation
- Bo Qi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Molecular layer deposition of amorphous carbon films

Low-k boron carbonitride films

Diffusion barriers for germanium

Defect free germanium oxide gap fill

Hydrogen free silicon dioxide

Non-conformal high selectivity film for etch critical dimension con...

Catalytic thermal deposition of carbon-containing materials

Doping semiconductor films

HDP sacrificial carbon gapfill

Conformal silicon oxide film deposition

Catalytic formation of boron and carbon films

Molecular layer deposition method and system

3D NAND etch

Deposition of low-stress boron-containing layers

Deposition of low-stress carbon-containing layers

Thermal deposition of doped silicon oxide

Methods of forming high boron-content hard mask materials

3D NAND etch

High-throughput HDP-CVD processes for advanced gapfill applications

Patents Applicationslast 30 patents

DEFECT FREE GERMANIUM OXIDE GAP FILL

PROCESSES FOR DEPOSITING SIB FILMS

PROCESSES TO DEPOSIT AMORPHOUS-SILICON ETCH PROTECTION LINER

CATALYTIC THERMAL DEPOSITION OF CARBON-CONTAINING MATERIALS

DEPOSITION OF LOW-STRESS CARBON-CONTAINING LAYERS

LOW-K BORON CARBONITRIDE FILMS

SUPER-CONFORMAL GERMANIUM OXIDE FILMS

DEFECT FREE GERMANIUM OXIDE GAP FILL

HDP SACRIFICIAL CARBON GAPFILL

CONFORMAL SILICON OXIDE FILM DEPOSITION

DOPING SEMICONDUCTOR FILMS

DIFFUSION BARRIERS FOR GERMANIUM

DEPOSITION OF LOW-STRESS CARBON-CONTAINING LAYERS

DEPOSITION OF LOW-STRESS BORON-CONTAINING LAYERS

MOLECULAR LAYER DEPOSITION METHOD AND SYSTEM

STACK FOR 3D-NAND MEMORY CELL

CATALYTIC FORMATION OF BORON AND CARBON FILMS

Molecular Layer Deposition of Amorphous Carbon Films

Hydrogen Free Silicon Dioxide

HIGH BORON-CONTENT HARD MASK MATERIALS

3D NAND Etch

Non-Conformal High Selectivity Film For Etch Critical Dimension Con...

METHODS OF FORMING SILICON NITRIDE ENCAPSULATION LAYERS

3D NAND Etch

Low Temperature Atomic Layer Deposition Of Silicon Nitride

HIGH-THROUGHPUT HDP-CVD PROCESSES FOR ADVANCED GAPFILL APPLICATIONS

High-throughput HDP-CVD processes for advanced gapfill applications