Bo-Tsung TSAI

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating image sensor
- Patent number 12,080,746
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,074,190
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary metal-oxide-semiconductor image sensor and method of...
- Patent number 11,581,360
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary metal-oxide-semiconductor image sensor and method of...
- Patent number 11,557,626
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 11,437,422
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,329,094
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system of estimating wafer crystalline orientation
- Patent number 11,282,707
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating image sensor
- Patent number 11,205,674
- Issue date Dec 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method for fabricating the same
- Patent number 11,183,532
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary metal-oxide-semiconductor image sensor
- Patent number 10,854,668
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 10,672,824
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 10,672,820
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CIS structure with complementary metal grid and deep trench isolati...
- Patent number 10,490,587
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an image sensor
- Patent number 10,490,596
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating complementary metal-oxide-semiconductor imag...
- Patent number 10,297,636
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel structure of an image sensor and fabrication method thereof
- Patent number 10,109,668
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary metal grid and deep trench isolation in CIS application
- Patent number 9,806,116
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING IMAGE SENSOR
- Publication number 20240371909
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR AND METHOD OF...
- Publication number 20230197762
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20220359601
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING IMAGE SENSOR
- Publication number 20220262843
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20220085083
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR AND METHOD OF...
- Publication number 20210210545
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR AND METHOD OF...
- Publication number 20210074759
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF ESTIMATING WAFER CRYSTALLINE ORIENTATION
- Publication number 20210074546
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- BO-TSUNG TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20200295072
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED STRUCTURE
- Publication number 20200295070
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING IMAGE SENSOR
- Publication number 20200105806
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20200098802
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR
- Publication number 20190273112
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED STRUCTURE
- Publication number 20190157333
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAG...
- Publication number 20190096952
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL STRUCTURE OF AN IMAGE SENSOR AND FABRICATION METHOD THEREOF
- Publication number 20180269249
- Publication date Sep 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN IMAGE SENSOR
- Publication number 20180151611
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20180151618
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIS STRUCTURE WITH COMPLEMENTARY METAL GRID AND DEEP TRENCH ISOLATI...
- Publication number 20180026061
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL GRID AND DEEP TRENCH ISOLATION IN CIS APPLICATION
- Publication number 20170125459
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS

Bo-Tsung TSAI

Person

Patents Grantslast 30 patents

Method for fabricating image sensor

Image sensor device

Method for fabricating hybrid bonded structure

Complementary metal-oxide-semiconductor image sensor and method of...

Complementary metal-oxide-semiconductor image sensor and method of...

Hybrid bonded structure

Image sensor

Method and system of estimating wafer crystalline orientation

Method for fabricating image sensor

Image sensor and method for fabricating the same

Complementary metal-oxide-semiconductor image sensor

Image sensor

Hybrid bonded structure

CIS structure with complementary metal grid and deep trench isolati...

Method for fabricating an image sensor

Method for fabricating complementary metal-oxide-semiconductor imag...

Pixel structure of an image sensor and fabrication method thereof

Complementary metal grid and deep trench isolation in CIS application

Patents Applicationslast 30 patents

METHOD FOR FABRICATING IMAGE SENSOR

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR AND METHOD OF...

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

METHOD FOR FABRICATING IMAGE SENSOR

IMAGE SENSOR DEVICE

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR AND METHOD OF...

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR AND METHOD OF...

METHOD AND SYSTEM OF ESTIMATING WAFER CRYSTALLINE ORIENTATION

IMAGE SENSOR

HYBRID BONDED STRUCTURE

METHOD FOR FABRICATING IMAGE SENSOR

IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR

HYBRID BONDED STRUCTURE

METHOD FOR FABRICATING COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAG...

PIXEL STRUCTURE OF AN IMAGE SENSOR AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING AN IMAGE SENSOR

IMAGE SENSOR

CIS STRUCTURE WITH COMPLEMENTARY METAL GRID AND DEEP TRENCH ISOLATI...

COMPLEMENTARY METAL GRID AND DEEP TRENCH ISOLATION IN CIS APPLICATION