Membership
Tour
Register
Log in
BO TU
Follow
Person
SHENZHEN, CN
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor chip packaging structure without soldering wire, and...
Patent number
10,665,563
Issue date
May 26, 2020
SHENZHEN JIEJIANDA INNOVATION TECHNOLOGY CO., LTD.
Bo Tu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STACKED SEMICONDUCTOR CHIP STRUCTURE AND ITS PROCESS
Publication number
20220085188
Publication date
Mar 17, 2022
Bo TU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D Stacked and Encapsulated LED Display Screen Module and Its Encap...
Publication number
20200105736
Publication date
Apr 2, 2020
Bo TU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP PACKAGING STRUCTURE WITHOUT SOLDERING WIRE, AND...
Publication number
20200091106
Publication date
Mar 19, 2020
SHENZHEN JIEJIANDA INNOVATION TECHNOLOGY CO., LTD.
BO TU
H01 - BASIC ELECTRIC ELEMENTS