Bo-Wei Liu

Follow

Person

Zhongli, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible printed circuit and printed circuit board soldered structure
- Patent number 9,854,674
- Issue date Dec 26, 2017
- LUXNET CORPORATION
- Ho-I Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY OF SEMICONDUCTOR AND HIGHLY THERMALLY CONDUCTIVE HEAT-DISS...
- Publication number 20180248336
- Publication date Aug 30, 2018
- LUXNET CORPORATION
- Hsing-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE HEAT-DISSIPATING SUBSTRATE
- Publication number 20180190520
- Publication date Jul 5, 2018
- LUXNET CORPORATION
- Hsing-Yen LIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HEAT-DISSIPATING SEMICONDUCTOR ASSEMBLY
- Publication number 20180191131
- Publication date Jul 5, 2018
- LUXNET CORPORATION
- Hsing-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS