Bo Yu

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits and methods of forming integrated circuits
- Patent number 11,164,858
- Issue date Nov 2, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conducting member for electrically coup...
- Patent number 11,004,972
- Issue date May 11, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Bo Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits including substrate con...
- Patent number 9,997,393
- Issue date Jun 12, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yuzhan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation and series resistance reduction of PA and RF switc...
- Patent number 9,960,115
- Issue date May 1, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Rui Tze Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a MIM capacitor with minimal voltage coeffici...
- Patent number 9,466,661
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Dina Triyoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding of silicon-on-insulator structure
- Patent number 9,087,906
- Issue date Jul 21, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single damascene method for RF IC passive component integration in...
- Patent number 6,534,374
- Issue date Mar 18, 2003
- Institute of Microelectronics
- Eric Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of polymer spacers for the fabrication of shallow trench isolat...
- Patent number 5,801,083
- Issue date Sep 1, 1998
- Chartered Semiconductor Manufacturing, Ltd.
- Bo Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS AND METHODS OF FORMING INTEGRATED CIRCUITS
- Publication number 20210288042
- Publication date Sep 16, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING THE SEMICONDUCTOR D...
- Publication number 20200395385
- Publication date Dec 17, 2020
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Bo YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH HIGH VOLTAGE AND HIGH DENSITY CAPACITORS A...
- Publication number 20170207209
- Publication date Jul 20, 2017
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Bo Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A MIM CAPACITOR WITH MINIMAL VOLTAGE COEFFICI...
- Publication number 20160104762
- Publication date Apr 14, 2016
- GLOBALFOUNDRIES INC.
- Dina TRIYOSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING OF SILICON-ON-INSULATOR STRUCTURE
- Publication number 20150097240
- Publication date Apr 9, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Purakh Raj VERMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single damascene method for RF IC passive component integration in...
- Publication number 20020197844
- Publication date Dec 26, 2002
- Institute of Microelectronics
- Eric Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuits and methods of forming integrated circuits

Semiconductor device having conducting member for electrically coup...

Methods for fabricating integrated circuits including substrate con...

Heat dissipation and series resistance reduction of PA and RF switc...

Method of fabricating a MIM capacitor with minimal voltage coeffici...

Grounding of silicon-on-insulator structure

Single damascene method for RF IC passive component integration in...

Use of polymer spacers for the fabrication of shallow trench isolat...

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS AND METHODS OF FORMING INTEGRATED CIRCUITS

A SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING THE SEMICONDUCTOR D...

INTEGRATED CIRCUITS WITH HIGH VOLTAGE AND HIGH DENSITY CAPACITORS A...

METHOD OF FABRICATING A MIM CAPACITOR WITH MINIMAL VOLTAGE COEFFICI...

GROUNDING OF SILICON-ON-INSULATOR STRUCTURE

Single damascene method for RF IC passive component integration in...