Bob Kong

Person

Newark, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electroless deposition of platinum on copper
- Patent number 9,023,137
- Issue date May 5, 2015
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of a zinc passivation layer on titanium or titanium alloy...
- Patent number 8,859,427
- Issue date Oct 14, 2014
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of a zinc passivation layer on titanium or titanium alloy...
- Patent number 8,728,879
- Issue date May 20, 2014
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for improving selectivity of electroless deposition processes
- Patent number 8,551,560
- Issue date Oct 8, 2013
- Intermolecular, Inc.
- Jinhong Tong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition of platinum on copper
- Patent number 8,545,998
- Issue date Oct 1, 2013
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Noble metal activation layer
- Patent number 8,278,215
- Issue date Oct 2, 2012
- Intermolecular, Inc.
- Zhi-Wen Sun
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Formation of a zinc passivation layer on titanium or titanium alloy...
- Patent number 8,143,164
- Issue date Mar 27, 2012
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Noble metal activation layer
- Patent number 7,968,462
- Issue date Jun 28, 2011
- Intermolecular, Inc.
- Zhi-Wen Sun
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electroless plating solution and process
- Patent number 6,797,312
- Issue date Sep 28, 2004
- Mattson Technology, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Electroless Deposition of Platinum on Copper
- Publication number 20130340648
- Publication date Dec 26, 2013
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOLAR CELL WITH METAL GRID FABRICATED BY ELECTROPLATING
- Publication number 20130125974
- Publication date May 23, 2013
- SILEVO, INC.
- Bob Wen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of A Zinc Passivation Layer on Titanium or Titanium Alloy...
- Publication number 20120325109
- Publication date Dec 27, 2012
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMATION OF A ZINC PASSIVATION LAYER ON TITANIUM OR TITANIUM ALLOY...
- Publication number 20120295436
- Publication date Nov 22, 2012
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless Deposition of Platinum on Copper
- Publication number 20120091590
- Publication date Apr 19, 2012
- Intermolecular, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Noble Metal Activation Layer
- Publication number 20110207320
- Publication date Aug 25, 2011
- Intermolecular, Inc.
- Zhi-Wen Sun
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Formation of a Zinc Passivation Layer on Titanium or Titanium Alloy...
- Publication number 20100203731
- Publication date Aug 12, 2010
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless Deposition of Platinum on Copper
- Publication number 20100055422
- Publication date Mar 4, 2010
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods For Improving Selectivity of Electroless Deposition Processes
- Publication number 20090291275
- Publication date Nov 26, 2009
- Jinhong Tong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless plating solution and process
- Publication number 20040142114
- Publication date Jul 22, 2004
- Mattson Technology, Inc.
- Bob Kong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Electroless deposition of platinum on copper

Formation of a zinc passivation layer on titanium or titanium alloy...

Formation of a zinc passivation layer on titanium or titanium alloy...

Methods for improving selectivity of electroless deposition processes

Electroless deposition of platinum on copper

Noble metal activation layer

Formation of a zinc passivation layer on titanium or titanium alloy...

Noble metal activation layer

Electroless plating solution and process

Patents Applicationslast 30 patents

Electroless Deposition of Platinum on Copper

SOLAR CELL WITH METAL GRID FABRICATED BY ELECTROPLATING

Formation of A Zinc Passivation Layer on Titanium or Titanium Alloy...

FORMATION OF A ZINC PASSIVATION LAYER ON TITANIUM OR TITANIUM ALLOY...

Electroless Deposition of Platinum on Copper

Noble Metal Activation Layer

Formation of a Zinc Passivation Layer on Titanium or Titanium Alloy...

Electroless Deposition of Platinum on Copper

Methods For Improving Selectivity of Electroless Deposition Processes

Electroless plating solution and process