BOB LEE

Person

TAIPEI HSIEN, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die with stepped side surface
- Patent number 12,062,596
- Issue date Aug 13, 2024
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate with a smooth groove about a perime...
- Patent number 11,791,289
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package substrate with a smooth groove about a perime...
- Patent number 11,302,652
- Issue date Apr 12, 2022
- Texas Instruments Incorporated
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadframe with die pad having cantilevers to secure electronic comp...
- Patent number 10,910,293
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- ChienHao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar leadframe substrate having a downset below within a die area
- Patent number 9,786,582
- Issue date Oct 10, 2017
- Texas Instruments Incorporated
- Chia-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...
- Publication number 20240258210
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...
- Publication number 20240047381
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE WITH STEPPED SIDE SURFACE
- Publication number 20230017286
- Publication date Jan 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...
- Publication number 20220246545
- Publication date Aug 4, 2022
- TEXAS INSTRUMENTS INCORPORATED
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...
- Publication number 20210193590
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- ChienHao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PLANAR LEADFRAME SUBSTRATE HAVING A DOWNSET BELOW WITHIN A DIE AREA
- Publication number 20170221799
- Publication date Aug 3, 2017
- TEXAS INSTRUMENTS INCORPORATED
- CHIA-YU CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor die with stepped side surface

Semiconductor package substrate with a smooth groove about a perime...

Semiconductor package substrate with a smooth groove about a perime...

Leadframe with die pad having cantilevers to secure electronic comp...

Planar leadframe substrate having a downset below within a die area

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...

SEMICONDUCTOR DIE WITH STEPPED SIDE SURFACE

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE ABOUT A PERIME...

PLANAR LEADFRAME SUBSTRATE HAVING A DOWNSET BELOW WITHIN A DIE AREA